Eiji Kamiyama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Image data processing method and image creating method
- Patent number 8,761,488
- Issue date Jun 24, 2014
- Sumco Corporation
- Eiji Kamiyama
- G01 - MEASURING TESTING
Information Patent Grant
Method for judging whether semiconductor wafer is non-defective waf...
- Patent number 8,379,196
- Issue date Feb 19, 2013
- Sumco Corporation
- Eiji Kamiyama
- G01 - MEASURING TESTING
Information Patent Grant
System and method of two-stepped laser scattering defect inspection
- Patent number 8,339,593
- Issue date Dec 25, 2012
- Sumco Corporation
- Eiji Kamiyama
- G01 - MEASURING TESTING
Information Patent Grant
Wafer surface measuring apparatus
- Patent number 8,284,395
- Issue date Oct 9, 2012
- Sumco Corporation
- Eiji Kamiyama
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a SOI structure having a SiGe layer interpo...
- Patent number 7,947,572
- Issue date May 24, 2011
- Sumitomo Mitsubishi Silicon Corp.
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 7,838,387
- Issue date Nov 23, 2010
- Sumco Corporation
- Eiji Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate, silicon substrate therefor and it's manufacturing me...
- Patent number 7,655,315
- Issue date Feb 2, 2010
- Sumco Corporation
- Eiji Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor substrate manufacturing method thereof
- Patent number 7,491,342
- Issue date Feb 17, 2009
- Sumco Corporation
- Eiji Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI structure having a SiGe layer interposed between the silicon an...
- Patent number 7,180,138
- Issue date Feb 20, 2007
- Sumitomo Mitsubishi Silicon Corp.
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE DATA PROCESSING METHOD AND IMAGE CREATING METHOD
- Publication number 20110194753
- Publication date Aug 11, 2011
- SUMCO CORPORATION
- Eiji Kamiyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR JUDGING WHETHER SEMICONDUCTOR WAFER IS NON-DEFECTIVE WAF...
- Publication number 20100309461
- Publication date Dec 9, 2010
- SUMCO CORPORATION
- Eiji Kamiyama
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SOI STRUCTURE HAVING A SIGE LAYER INTERPO...
- Publication number 20100221877
- Publication date Sep 2, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SURFACE MEASURING APPARATUS
- Publication number 20100201976
- Publication date Aug 12, 2010
- SUMCO CORPORATION
- Eiji KAMIYAMA
- G01 - MEASURING TESTING
Information Patent Application
LASER SCATTERING DEFECT INSPECTION SYSTEM AND LASER SCATTERING DEFE...
- Publication number 20100085561
- Publication date Apr 8, 2010
- SUMCO CORPORATION
- Eiji KAMIYAMA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER SURFACE INSPECTION APPARATUS
- Publication number 20090147250
- Publication date Jun 11, 2009
- SUMCO CORPORATION
- Terunori TANAKA
- G01 - MEASURING TESTING
Information Patent Application
SILICON WAFER FOR MANUFACTURING SOI WAFER, SOI WAFER, AND METHOD FO...
- Publication number 20080213989
- Publication date Sep 4, 2008
- Eiji Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI substrate, silicon substrate therefor and it's manufacturing me...
- Publication number 20070228522
- Publication date Oct 4, 2007
- Eiji Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated semiconductor substrate process for producing the same
- Publication number 20060118935
- Publication date Jun 8, 2006
- Eiji Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI structure having a sige layer interposed between the silicon an...
- Publication number 20060063356
- Publication date Mar 23, 2006
- Sumitomo Mitsubishi Silicon Corporation
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI structure having a sige layer interposed between the silicon an...
- Publication number 20050242396
- Publication date Nov 3, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI structure having a SiGe Layer interposed between the silicon an...
- Publication number 20030230778
- Publication date Dec 18, 2003
- Sumitomo Mitsubishi Silicon Corporation
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS

Eiji Kamiyama

Person

Patents Grantslast 30 patents

Image data processing method and image creating method

Method for judging whether semiconductor wafer is non-defective waf...

System and method of two-stepped laser scattering defect inspection

Wafer surface measuring apparatus

Method of manufacturing a SOI structure having a SiGe layer interpo...

Method for manufacturing SOI wafer

SOI substrate, silicon substrate therefor and it's manufacturing me...

Bonded semiconductor substrate manufacturing method thereof

SOI structure having a SiGe layer interposed between the silicon an...

Patents Applicationslast 30 patents

IMAGE DATA PROCESSING METHOD AND IMAGE CREATING METHOD

METHOD FOR JUDGING WHETHER SEMICONDUCTOR WAFER IS NON-DEFECTIVE WAF...

METHOD OF MANUFACTURING A SOI STRUCTURE HAVING A SIGE LAYER INTERPO...

WAFER SURFACE MEASURING APPARATUS

LASER SCATTERING DEFECT INSPECTION SYSTEM AND LASER SCATTERING DEFE...

SEMICONDUCTOR WAFER SURFACE INSPECTION APPARATUS

SILICON WAFER FOR MANUFACTURING SOI WAFER, SOI WAFER, AND METHOD FO...

SOI substrate, silicon substrate therefor and it's manufacturing me...

Laminated semiconductor substrate process for producing the same

SOI structure having a sige layer interposed between the silicon an...

SOI structure having a sige layer interposed between the silicon an...

SOI structure having a SiGe Layer interposed between the silicon an...