Eiji Kawamoto

Person

Takatsuki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Elastic wave device and electronic device using the same
- Patent number 8,704,424
- Issue date Apr 22, 2014
- Panasonic Corporation
- Toru Yamaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave element and electronic device including the same
- Patent number 8,564,171
- Issue date Oct 22, 2013
- Panasonic Corporation
- Toru Yamaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device and electronic device using the same
- Patent number 8,471,433
- Issue date Jun 25, 2013
- Panasonic Corporation
- Toru Yamaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device and electronic apparatus using the same
- Patent number 8,334,737
- Issue date Dec 18, 2012
- Panasonic Corporation
- Toru Yamaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Passive component incorporating interposer
- Patent number 7,968,800
- Issue date Jun 28, 2011
- Panasonic Corporation
- Tatsuo Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing clad board for forming circuitry, clad boar...
- Patent number 7,754,321
- Issue date Jul 13, 2010
- Panasonic Corporation
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing component-embedded printed wiring board
- Patent number 7,694,415
- Issue date Apr 13, 2010
- Panasonic Corporation
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer module and method of manufacturing the same
- Patent number 7,532,485
- Issue date May 12, 2009
- Panasonic Corporation
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit-component-containing module
- Patent number 7,382,628
- Issue date Jun 3, 2008
- Matsushita Electric Industrial Co., Ltd.
- Eiji Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component-built-in module
- Patent number 6,998,532
- Issue date Feb 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Eiji Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed-circuit board
- Patent number 6,890,449
- Issue date May 10, 2005
- Matsushita Electric Industrial Co., Ltd.
- Eiji Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing clad board for forming circuitry, clad boar...
- Patent number 6,833,042
- Issue date Dec 21, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 6,523,258
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Eiji Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of wiring board, and conductive paste used the...
- Patent number 6,514,364
- Issue date Feb 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing ceramic substrate
- Patent number 6,374,733
- Issue date Apr 23, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masaaki Hayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic components using intaglio plate...
- Patent number 6,347,584
- Issue date Feb 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Eiji Kawamoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Direct-contact type image sensor using optical fiber array with lig...
- Patent number 5,448,055
- Issue date Sep 5, 1995
- Matsushita Electric Industrial Co., Ltd.
- Tetsuro Nakamura
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CHARGING CONTROL METHOD, PROGRAM, AND CHARGING CONTROL SYSTEM
- Publication number 20230344258
- Publication date Oct 26, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Koji ARIMURA
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20130257221
- Publication date Oct 3, 2013
- PANASONIC CORPORATION
- Toru YAMAJI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE ELEMENT AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20120086309
- Publication date Apr 12, 2012
- Toru YAMAJI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20110084573
- Publication date Apr 14, 2011
- Toru YAMAJI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE AND ELECTRONIC APPARATUS USING THE SAME
- Publication number 20110012695
- Publication date Jan 20, 2011
- PANASONIC CORPORATION
- Toru Yamaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PASSIVE COMPONENT INCORPORATING INTERPOSER
- Publication number 20100155119
- Publication date Jun 24, 2010
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sasaoka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING COMPONENT-EMBEDDED PRINTED WIRING BOARD
- Publication number 20100146779
- Publication date Jun 17, 2010
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED PRINTED WIRING BOARD
- Publication number 20100147569
- Publication date Jun 17, 2010
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer module and method of manufacturing the same
- Publication number 20060261472
- Publication date Nov 23, 2006
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component-embedded printed wiring board and method of manufacturing...
- Publication number 20060260122
- Publication date Nov 23, 2006
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing clad board for forming circuitry, clad boar...
- Publication number 20050249933
- Publication date Nov 10, 2005
- Shigeru Yamane
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit-component-containing module
- Publication number 20050051358
- Publication date Mar 10, 2005
- Eiji Kawamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic component-built-in module
- Publication number 20050013082
- Publication date Jan 20, 2005
- Eiji Kawamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit forming board producing method, circuit forming board, and...
- Publication number 20030091787
- Publication date May 15, 2003
- Shigeru Yamane
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for manufacturing printed-circuit board
- Publication number 20020170876
- Publication date Nov 21, 2002
- Eiji Kawamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
MANUFACTURING METHOD OF WIRING BOARD, AND CONDUCTIVE PASTE USED THE...
- Publication number 20020056509
- Publication date May 16, 2002
- KAZUHIRO MIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20010025415
- Publication date Oct 4, 2001
- Eiji Kawamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Eiji Kawamoto

Person

Patents Grantslast 30 patents

Elastic wave device and electronic device using the same

Acoustic wave element and electronic device including the same

Elastic wave device and electronic device using the same

Acoustic wave device and electronic apparatus using the same

Passive component incorporating interposer

Method of manufacturing clad board for forming circuitry, clad boar...

Method of manufacturing component-embedded printed wiring board

Multilayer module and method of manufacturing the same

Circuit-component-containing module

Electronic component-built-in module

Method for manufacturing printed-circuit board

Method of manufacturing clad board for forming circuitry, clad boar...

Method of manufacturing printed circuit board

Manufacturing method of wiring board, and conductive paste used the...

Method of manufacturing ceramic substrate

Method of manufacturing electronic components using intaglio plate...

Direct-contact type image sensor using optical fiber array with lig...

Patents Applicationslast 30 patents

CHARGING CONTROL METHOD, PROGRAM, AND CHARGING CONTROL SYSTEM

ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME

ACOUSTIC WAVE ELEMENT AND ELECTRONIC DEVICE INCLUDING THE SAME

ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME

ACOUSTIC WAVE DEVICE AND ELECTRONIC APPARATUS USING THE SAME

PASSIVE COMPONENT INCORPORATING INTERPOSER

METHOD OF MANUFACTURING COMPONENT-EMBEDDED PRINTED WIRING BOARD

COMPONENT-EMBEDDED PRINTED WIRING BOARD

Multilayer module and method of manufacturing the same

Component-embedded printed wiring board and method of manufacturing...

Method of manufacturing clad board for forming circuitry, clad boar...

Circuit-component-containing module

Electronic component-built-in module

Circuit forming board producing method, circuit forming board, and...

Method for manufacturing printed-circuit board

MANUFACTURING METHOD OF WIRING BOARD, AND CONDUCTIVE PASTE USED THE...

Method of manufacturing printed circuit board