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Eiji Kikuchi
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Musashimurayama, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Die bonding method and apparatus
Patent number
6,547,902
Issue date
Apr 15, 2003
Kabushiki Kaisha Shinkawa
Tsuneharu Arai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer ring feeding apparatus
Patent number
6,062,795
Issue date
May 16, 2000
Kabushiki Kaisha Shinkawa
Shigeru Fuke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Suction holding assembly for lead frames
Patent number
5,839,877
Issue date
Nov 24, 1998
Kabushiki Kaisha Shinkawa
Eiji Kikuchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lead frame pusher device
Patent number
5,827,035
Issue date
Oct 27, 1998
Kabushiki Kaisha Shinkawa
Shigeru Fuke
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Lead frame magazine fastening structure
Patent number
5,749,442
Issue date
May 12, 1998
Kabushiki Kaisha Shinkawa
Eiji Kikuchi
B66 - HOISTING LIFTING HAULING
Information
Patent Grant
Lead frame detection apparatus
Patent number
5,741,988
Issue date
Apr 21, 1998
Kabushiki Kaisha Shinkawa
Eiji Kikuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame suction holding device
Patent number
5,685,589
Issue date
Nov 11, 1997
Kabushiki Kaisha Shinkawa
Eiji Kikuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus
Patent number
5,603,446
Issue date
Feb 18, 1997
Kabushiki Kaisha Shinkawa
Eiji Kikuchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Die bonding method and apparatus
Publication number
20010004002
Publication date
Jun 21, 2001
KABUSHIKI KAISHA SHINKAWA
Tsuneharu Arai
H01 - BASIC ELECTRIC ELEMENTS