Eiji Kimura

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Saitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for rear part of vehicle
- Patent number 9,566,847
- Issue date Feb 14, 2017
- Honda Motor Co., Ltd.
- Makoto Fujiwara
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SPOILER DEVICE
- Publication number 20240351645
- Publication date Oct 24, 2024
- Honda Motor Co., Ltd.
- Yuki NAKAMURA
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REAR PART OF VEHICLE
- Publication number 20160272052
- Publication date Sep 22, 2016
- Honda Motor Co., Ltd.
- Makoto Fujiwara
- B60 - VEHICLES IN GENERAL