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Patents Grants
last 30 patents
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Patent Grant
Wire bonding method and wire bonding device
Patent number
11,404,393
Issue date
Aug 2, 2022
Kaijo Corporation
Eiji Kimura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
Publication number
20210366869
Publication date
Nov 25, 2021
KAIJO CORPORATION
Eiji KIMURA
H01 - BASIC ELECTRIC ELEMENTS