Eiji KUROSE

Person

Ora-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with back side metal
- Patent number 12,040,310
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die support structure for thin die
- Patent number 11,894,234
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package and related methods
- Patent number 11,791,297
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Sw Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with back side metal
- Patent number 11,562,981
- Issue date Jan 24, 2023
- Semiconductor Components Industries, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thin die and related methods
- Patent number 11,404,276
- Issue date Aug 2, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 11,404,277
- Issue date Aug 2, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package electrical contact structures and related met...
- Patent number 11,393,692
- Issue date Jul 19, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package electrical contacts and related methods
- Patent number 11,367,619
- Issue date Jun 21, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator die support structures and related methods
- Patent number 11,361,970
- Issue date Jun 14, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,348,796
- Issue date May 31, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities and related methods
- Patent number 11,342,189
- Issue date May 24, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-faced molded semiconductor package and related methods
- Patent number 11,328,930
- Issue date May 10, 2022
- Semiconductor Components Industries, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package and related methods
- Patent number 11,244,918
- Issue date Feb 8, 2022
- Semiconductor Components Industries, LLC
- Sw Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level chip-scale packages and methods of manufacture
- Patent number 11,018,030
- Issue date May 25, 2021
- Semiconductor Components Industries, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with back side metal
- Patent number 10,943,886
- Issue date Mar 9, 2021
- Semiconductor Components Industries, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-faced molded semiconductor package and related methods
- Patent number 10,529,576
- Issue date Jan 7, 2020
- Semiconductor Components Industries, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of automatically inspecting an appe...
- Patent number 8,809,076
- Issue date Aug 19, 2014
- Semiconductor Components Industries, LLC
- Hideaki Yoshimi
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,728,876
- Issue date May 20, 2014
- Semiconductor Components Industries, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD FOR POWER METAL LINES
- Publication number 20240379603
- Publication date Nov 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20240332025
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20240203744
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240006363
- Publication date Jan 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES WITH BACK SIDE METAL
- Publication number 20230118179
- Publication date Apr 20, 2023
- Semiconductor Components Industries, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20220351977
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS
- Publication number 20220351978
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
- Publication number 20220301876
- Publication date Sep 22, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
- Publication number 20220270884
- Publication date Aug 25, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20220246434
- Publication date Aug 4, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKMETAL REMOVAL METHODS
- Publication number 20220238342
- Publication date Jul 28, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FACED MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220230885
- Publication date Jul 21, 2022
- Semiconductor Components Industries, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220157756
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES WITH BACK SIDE METAL
- Publication number 20210159210
- Publication date May 27, 2021
- Semiconductor Components Industries, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20210035807
- Publication date Feb 4, 2021
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20200395217
- Publication date Dec 17, 2020
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20200365408
- Publication date Nov 19, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL CHIP-SCALE PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20200303216
- Publication date Sep 24, 2020
- Semiconductor Components Industries, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKMETAL REMOVAL METHODS
- Publication number 20200286736
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS
- Publication number 20200286735
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20200279747
- Publication date Sep 3, 2020
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUPPORT STRUCTURES AND RELATED METHODS
- Publication number 20200258750
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
- Publication number 20200258751
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
- Publication number 20200258752
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FACED MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200105536
- Publication date Apr 2, 2020
- Semiconductor Components Industries, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES WITH BACK SIDE METAL
- Publication number 20190333891
- Publication date Oct 31, 2019
- Semiconductor Components Industries, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FACED MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057874
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057947
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A BOND PAD
- Publication number 20170352582
- Publication date Dec 7, 2017
- Semiconductor Components Industries, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS

Eiji KUROSE

Person

Patents Grantslast 30 patents

Die sidewall coatings and related methods

Methods of forming semiconductor packages with back side metal

Semiconductor packages with die including cavities

Backmetal removal methods

Semiconductor packages with die support structure for thin die

Molded semiconductor package and related methods

Methods of forming semiconductor packages with back side metal

Semiconductor packages with thin die and related methods

Die sidewall coatings and related methods

Semiconductor package electrical contact structures and related met...

Semiconductor package electrical contacts and related methods

Silicon-on-insulator die support structures and related methods

Backmetal removal methods

Semiconductor packages with die including cavities and related methods

Multi-faced molded semiconductor package and related methods

Molded semiconductor package and related methods

Fan-out wafer level chip-scale packages and methods of manufacture

Methods of forming semiconductor packages with back side metal

Multi-faced molded semiconductor package and related methods

Semiconductor device and method of automatically inspecting an appe...

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

STRUCTURE AND METHOD FOR POWER METAL LINES

DIE SIDEWALL COATINGS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

METHODS OF FORMING SEMICONDUCTOR PACKAGES WITH BACK SIDE METAL

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

DIE SIDEWALL COATINGS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS

SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

BACKMETAL REMOVAL METHODS

MULTI-FACED MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

METHODS OF FORMING SEMICONDUCTOR PACKAGES WITH BACK SIDE METAL

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

FAN-OUT WAFER LEVEL CHIP-SCALE PACKAGES AND METHODS OF MANUFACTURE

BACKMETAL REMOVAL METHODS

SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS

DIE SIDEWALL COATINGS AND RELATED METHODS

DIE SUPPORT STRUCTURES AND RELATED METHODS

SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS

MULTI-FACED MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

METHODS OF FORMING SEMICONDUCTOR PACKAGES WITH BACK SIDE METAL

MULTI-FACED MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A BOND PAD