Eiji MOCHIZUKI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structure for bipolar transistor with constricted bumps
- Patent number 11,705,419
- Issue date Jul 18, 2023
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having block electrode bonded to collector ele...
- Patent number 11,545,409
- Issue date Jan 3, 2023
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for integrating current sensors in a power sem...
- Patent number 11,531,075
- Issue date Dec 20, 2022
- Wisconsin Alumni Research Foundation
- Robert D. Lorenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for integrating current sensors in a power sem...
- Patent number 11,085,977
- Issue date Aug 10, 2021
- Wisconsin Alumni Research Foundation
- Robert D. Lorenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,355,089
- Issue date Jul 16, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,297,527
- Issue date May 21, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,128,166
- Issue date Nov 13, 2018
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat dissipation and method of making same
- Patent number 10,090,222
- Issue date Oct 2, 2018
- Fuji Electric Co., Ltd.
- Akira Hirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 10,090,223
- Issue date Oct 2, 2018
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,999,146
- Issue date Jun 12, 2018
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,824,950
- Issue date Nov 21, 2017
- Fuji Electric Co., Ltd.
- Kyohei Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,786,587
- Issue date Oct 10, 2017
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding structure and thermocompression bonding m...
- Patent number 9,579,746
- Issue date Feb 28, 2017
- Fuji Electric Co., Ltd.
- Yoshito Kinoshita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,504,154
- Issue date Nov 22, 2016
- Fuji Electric Co., Ltd.
- Shinji Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,431,326
- Issue date Aug 30, 2016
- Fuji Electric Co., Ltd.
- Toshio Denta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,406,603
- Issue date Aug 2, 2016
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 9,269,644
- Issue date Feb 23, 2016
- Fuji Electric Co., Ltd.
- Yoshitaka Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,944,310
- Issue date Feb 3, 2015
- Fuji Electric Co., Ltd.
- Takeshi Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging module, fabricating method therefor, and imaging device
- Patent number 8,796,798
- Issue date Aug 5, 2014
- Ricoh Company, Ltd.
- Daiki Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 8,779,584
- Issue date Jul 15, 2014
- Fuji Electric Co., Ltd.
- Toshiyuki Yokomae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,748,225
- Issue date Jun 10, 2014
- Fuji Electric Co., Ltd.
- Kyohei Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical scanning device, image forming apparatus, and image project...
- Patent number 8,681,408
- Issue date Mar 25, 2014
- Ricoh Company, Limited
- Eiji Mochizuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number 8,598,688
- Issue date Dec 3, 2013
- Fuji Electric Co., Ltd.
- Kyohei Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical deflector and optical device
- Patent number 8,553,306
- Issue date Oct 8, 2013
- Ricoh Company, Ltd.
- Tetsurou Saitoh
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number D689833
- Issue date Sep 17, 2013
- Fuji Electric Co., Ltd.
- Motohito Hori
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Optical scanner and image forming apparatus
- Patent number 8,373,916
- Issue date Feb 12, 2013
- Ricoh Company, Ltd.
- Mitsumi Fujii
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number D674760
- Issue date Jan 22, 2013
- Fuji Electric Co., Ltd.
- Eiji Mochizuki
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Soldering method and method of manufacturing semiconductor device i...
- Patent number 8,273,644
- Issue date Sep 25, 2012
- Fuji Electric Co., Ltd.
- Kazunaga Onishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vibration elements
- Patent number 8,199,389
- Issue date Jun 12, 2012
- Ricoh Company, Ltd.
- Mochizuki Eiji
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power semiconductor module and method of manufacturing the same
- Patent number 8,158,458
- Issue date Apr 17, 2012
- Fuji Electric Co., Ltd.
- Osamu Ikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFUCTURING METHOD OF PACKAGING STRUCTURE FOR BIPOLAR TRANSISTOR...
- Publication number 20230307400
- Publication date Sep 28, 2023
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Integrating Current Sensors in a Power Sem...
- Publication number 20210364581
- Publication date Nov 25, 2021
- Wisconsin Alumni Research Foundation
- Robert D. Lorenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
- Publication number 20210242156
- Publication date Aug 5, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
- Publication number 20210242103
- Publication date Aug 5, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Integrating Current Sensors in a Power Sem...
- Publication number 20180329002
- Publication date Nov 15, 2018
- Wisconsin Alumni Research Foundation
- Robert D. Lorenz
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION AND METHOD OF MAKING SAME
- Publication number 20180240730
- Publication date Aug 23, 2018
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20170317008
- Publication date Nov 2, 2017
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20170181300
- Publication date Jun 22, 2017
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170077009
- Publication date Mar 16, 2017
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20160343641
- Publication date Nov 24, 2016
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20160322287
- Publication date Nov 3, 2016
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20150372095
- Publication date Dec 24, 2015
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150187671
- Publication date Jul 2, 2015
- Fuji Electric Co., Ltd.
- Kyohei FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140355219
- Publication date Dec 4, 2014
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING STRUCTURE AND THERMOCOMPRESSION BONDING M...
- Publication number 20140301769
- Publication date Oct 9, 2014
- Fuji Electric Co., Ltd.
- Yoshito KINOSHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140246783
- Publication date Sep 4, 2014
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140224862
- Publication date Aug 14, 2014
- Fuji Electric Co., Ltd.
- Takeshi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING THE SAME
- Publication number 20140080262
- Publication date Mar 20, 2014
- Fuji Electric Co., Ltd.
- Yoshitaka NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130334672
- Publication date Dec 19, 2013
- FUJI ELECTRIC CO., LTD.
- Toshio Denta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130237016
- Publication date Sep 12, 2013
- Fuji Electric Co., Ltd.
- Kyohei FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20120313224
- Publication date Dec 13, 2012
- Fuji Electric Co., Ltd.
- Kyohei FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING MODULE, FABRICATING METHOD THEREFOR, AND IMAGING DEVICE
- Publication number 20110180893
- Publication date Jul 28, 2011
- RICOH COMPANY, LTD.
- Daiki MINEGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SCANNING DEVICE, IMAGE FORMING APPARATUS, AND IMAGE PROJECT...
- Publication number 20110085220
- Publication date Apr 14, 2011
- Eiji MOCHIZUKI
- G02 - OPTICS
Information Patent Application
Method for manufacturing semiconductor module
- Publication number 20110059581
- Publication date Mar 10, 2011
- Fuji Electric Device Technology Co., Ltd.
- Masafumi Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SCANNER AND IMAGE FORMING APPARATUS
- Publication number 20100232833
- Publication date Sep 16, 2010
- Mitsumi Fujii
- G02 - OPTICS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100055845
- Publication date Mar 4, 2010
- Fuji Electric Device Technology Co., LTD.
- Osamu Ikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATION ELEMENTS
- Publication number 20090225384
- Publication date Sep 10, 2009
- Mochizuki Eiji
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING RING-SHAPED MEMBER, BACKUP RING AND SEAL ST...
- Publication number 20090121442
- Publication date May 14, 2009
- Yasufumi Uozumi
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Semiconductor device and method for manufacturing semiconductor device
- Publication number 20080284033
- Publication date Nov 20, 2008
- Fuji Electric Device Technology Co., LTD.
- Masafumi Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and method for manufacturing semiconductor module
- Publication number 20080284007
- Publication date Nov 20, 2008
- Fuji Electric Device Technology Co., LTD.
- Masafumi Horio
- H01 - BASIC ELECTRIC ELEMENTS

Eiji MOCHIZUKI

Person

Patents Grantslast 30 patents

Packaging structure for bipolar transistor with constricted bumps

Semiconductor module having block electrode bonded to collector ele...

Method and apparatus for integrating current sensors in a power sem...

Method and apparatus for integrating current sensors in a power sem...

Semiconductor device and semiconductor device manufacturing method

Semiconductor device

Power semiconductor module

Semiconductor device with heat dissipation and method of making same

Semiconductor device and method of manufacturing same

Semiconductor module

Semiconductor device

Semiconductor device and method for manufacturing the semiconductor...

Thermocompression bonding structure and thermocompression bonding m...

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the semiconductor...

Method for producing semiconductor device

Method of manufacturing a semiconductor device

Imaging module, fabricating method therefor, and imaging device

Semiconductor apparatus

Semiconductor device manufacturing method

Optical scanning device, image forming apparatus, and image project...

Semiconductor device

Optical deflector and optical device

Semiconductor device

Optical scanner and image forming apparatus

Semiconductor device

Soldering method and method of manufacturing semiconductor device i...

Vibration elements

Power semiconductor module and method of manufacturing the same

Patents Applicationslast 30 patents

MANUFUCTURING METHOD OF PACKAGING STRUCTURE FOR BIPOLAR TRANSISTOR...

Method and Apparatus for Integrating Current Sensors in a Power Sem...

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

Method and Apparatus for Integrating Current Sensors in a Power Sem...

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THERMOCOMPRESSION BONDING STRUCTURE AND THERMOCOMPRESSION BONDING M...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

IMAGING MODULE, FABRICATING METHOD THEREFOR, AND IMAGING DEVICE

OPTICAL SCANNING DEVICE, IMAGE FORMING APPARATUS, AND IMAGE PROJECT...

Method for manufacturing semiconductor module

OPTICAL SCANNER AND IMAGE FORMING APPARATUS

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

VIBRATION ELEMENTS

METHOD OF MANUFACTURING RING-SHAPED MEMBER, BACKUP RING AND SEAL ST...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor module and method for manufacturing semiconductor module