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Eiji Ogata

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  • Fukuoka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Multilayer wiring substrate
    • Patent number 7,575,442
    • Issue date Aug 18, 2009
    • Fujitsu Limited
    • Eiji Ogata
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Multilayer wiring substrate
    • Publication number 20080227312
    • Publication date Sep 18, 2008
    • Fujitsu Limited
    • Eiji Ogata
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR