Eiji Shigemura

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thin adhesive sheet for working semiconductor wafers
- Patent number 6,010,782
- Issue date Jan 4, 2000
- Nitto Electric Industrial Co., Ltd.
- Gosei Uemura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for working a semiconductor wafer
- Patent number 5,714,029
- Issue date Feb 3, 1998
- Nitto Electric Industrial Co., Ltd.
- Gosei Uemura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thin adhesive sheet for working semiconductor wafers
- Patent number 5,637,395
- Issue date Jun 10, 1997
- Nitto Electric Industrial Co., Ltd.
- Gosei Uemura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of stripping off wafer-protective sheet
- Patent number 5,254,201
- Issue date Oct 19, 1993
- Nitto Denko Corporation
- Yukari Konda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL