Eiji Takano

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,818,501
- Issue date Oct 27, 2020
- TOSHIBA MEMORY CORPORATION
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,804,152
- Issue date Oct 13, 2020
- TOSHIBA MEMORY CORPORATION
- Masaya Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,741,505
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Masaya Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and semiconductor manufacturing...
- Patent number 10,546,769
- Issue date Jan 28, 2020
- TOSHIBA MEMORY CORPORATION
- Tatsuhiko Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,211,165
- Issue date Feb 19, 2019
- TOSHIBA MEMORY CORPORATION
- Masaya Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and laminated body
- Patent number 9,997,390
- Issue date Jun 12, 2018
- TOSHIBA MEMORY CORPORATION
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 8,975,160
- Issue date Mar 10, 2015
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,704,337
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device, method for detecti...
- Patent number 8,338,918
- Issue date Dec 25, 2012
- Kabushiki Kaisha Toshiba
- Masahiro Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,993,974
- Issue date Aug 9, 2011
- Kabushiki Kaisha Toshiba
- Masahiro Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type package for semiconductor device
- Patent number 6,376,907
- Issue date Apr 23, 2002
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounted on board by flip-chip and method for m...
- Patent number 6,214,156
- Issue date Apr 10, 2001
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip interconnection having enhanced electrical connections
- Patent number 5,952,727
- Issue date Sep 14, 1999
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230063204
- Publication date Mar 2, 2023
- KIOXIA Corporation
- Eiji TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190362980
- Publication date Nov 28, 2019
- Toshiba Memory Corporation
- Takashi SHIRONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348324
- Publication date Nov 14, 2019
- Toshiba Memory Corporation
- Masaya SHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20190139908
- Publication date May 9, 2019
- Toshiba Memory Corporation
- Masaya SHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20180277493
- Publication date Sep 27, 2018
- Toshiba Memory Corporation
- Masaya SHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND LAMINATED BODY
- Publication number 20160276201
- Publication date Sep 22, 2016
- KABUSHIKI KAISHA TOSHIBA
- Eiji TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20160276200
- Publication date Sep 22, 2016
- Kabushiki Kaisha Toshiba
- Tatsuhiko SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20140287567
- Publication date Sep 25, 2014
- Kabushiki Kaisha Toshiba
- Eiji TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, METHOD FOR DETECTI...
- Publication number 20110241180
- Publication date Oct 6, 2011
- Kabushiki Kaisha Toshiba
- Masahiro Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110073974
- Publication date Mar 31, 2011
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100213564
- Publication date Aug 26, 2010
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, METHOD FOR DETECTI...
- Publication number 20090194865
- Publication date Aug 6, 2009
- Kabushiki Kaisha Toshiba
- Masahiro Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS

Eiji Takano

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Semiconductor manufacturing method and semiconductor manufacturing...

Method of manufacturing semiconductor device and semiconductor device

Semiconductor manufacturing method and laminated body

Manufacturing method for semiconductor device

Semiconductor device and method for manufacturing the same

Method for manufacturing a semiconductor device, method for detecti...

Method for manufacturing a semiconductor device

Ball grid array type package for semiconductor device

Semiconductor device mounted on board by flip-chip and method for m...

Flip-chip interconnection having enhanced electrical connections

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MANUFACTURING METHOD AND LAMINATED BODY

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, METHOD FOR DETECTI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, METHOD FOR DETECTI...