Eiji Toyoda

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive composition and biosensor
- Patent number 11,837,377
- Issue date Dec 5, 2023
- Nitto Denko Corporation
- Eiji Toyoda
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Laminate patchable to living body
- Patent number 11,576,819
- Issue date Feb 14, 2023
- Nitto Denko Corporation
- Naoya Sugimoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Patchable biosensor
- Patent number 11,510,623
- Issue date Nov 29, 2022
- Nitto Denko Corporation
- Shigeyasu Mori
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electrically conductive composition and biosensor
- Patent number 11,217,360
- Issue date Jan 4, 2022
- Nitto Denko Corporation
- Eiji Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate patchable to living body
- Patent number 11,090,405
- Issue date Aug 17, 2021
- Nitto Denko Corporation
- Eiji Toyoda
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Producing method of wired circuit board
- Patent number 11,006,530
- Issue date May 11, 2021
- Nitto Denko Corporation
- Keisuke Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sheet for sealing electronic device and method for manufactur...
- Patent number 10,297,470
- Issue date May 21, 2019
- Nitto Denko Corporation
- Yusaku Shimizu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wired circuit board
- Patent number 10,194,861
- Issue date Feb 5, 2019
- Nitto Denko Corporation
- Keisuke Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally curable resin sheet for sealing semiconductor chip, and m...
- Patent number 9,659,883
- Issue date May 23, 2017
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile terminal power receiving module utilizing wireless power tra...
- Patent number 9,466,994
- Issue date Oct 11, 2016
- Nitto Denko Corporation
- Hiroshi Yamazaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermosetting resin sheet for sealing electronic component, resin-s...
- Patent number 9,147,625
- Issue date Sep 29, 2015
- Nitto Denko Corporation
- Yusaku Shimizu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Label sheet for cleaning and conveying member having cleaning function
- Patent number 9,131,829
- Issue date Sep 15, 2015
- Nitto Denko Corporation
- Makoto Namikawa
- B08 - CLEANING
Information Patent Grant
Method for manufacturing electronic parts device and resin composit...
- Patent number 8,938,878
- Issue date Jan 27, 2015
- Nitto Denko Corporation
- Eiji Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting encapsulation adhesive sheet
- Patent number 8,922,031
- Issue date Dec 30, 2014
- Nitto Denko Corporation
- Eiji Toyoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing resin sheet, method for producing electronic component pack...
- Patent number 8,912,669
- Issue date Dec 16, 2014
- Nitto Denko Corporation
- Eiji Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 8,906,746
- Issue date Dec 9, 2014
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 8,580,619
- Issue date Nov 12, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 8,298,872
- Issue date Oct 30, 2012
- Nitto Denko Corporation
- Takashi Oda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 8,269,213
- Issue date Sep 18, 2012
- Nitto Denko Corporation
- Hiroshi Noro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Cleaning sheet and method of cleaning substrate processing equipment
- Patent number 7,846,258
- Issue date Dec 7, 2010
- Nitto Denko Corporation
- Yoshio Terada
- B08 - CLEANING
Information Patent Grant
Cleaning sheet, conveying member using the same, and substrate proc...
- Patent number 7,793,668
- Issue date Sep 14, 2010
- Nitto Denko Corporation
- Makoto Namikawa
- B08 - CLEANING
Information Patent Grant
Cleaning sheet, conveying member using the same, and substrate proc...
- Patent number 7,713,356
- Issue date May 11, 2010
- Nitto Denko Corporation
- Makoto Namikawa
- B08 - CLEANING
Information Patent Grant
Cleaning member and cleaning method
- Patent number 7,615,288
- Issue date Nov 10, 2009
- Nitto Denko Corporation
- Yoshio Terada
- B08 - CLEANING
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 7,501,711
- Issue date Mar 10, 2009
- Nitto Denko Corporation
- Takuya Eto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for producing epoxy resin composition for semiconductor enca...
- Patent number 7,268,191
- Issue date Sep 11, 2007
- Nitto Denko Corporation
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Cleaning sheet, conveying member using the same, and substrate proc...
- Patent number 6,821,620
- Issue date Nov 23, 2004
- Nitto Denko Corporation
- Makoto Namikawa
- B08 - CLEANING
Information Patent Grant
Organic electroluminescence device and method for producing the same
- Patent number 6,652,700
- Issue date Nov 25, 2003
- Nitto Denko Corporation
- Makoto Namikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing resist material
- Patent number 6,638,864
- Issue date Oct 28, 2003
- Nitto Denko Corporation
- Eiji Toyoda
- B08 - CLEANING
Information Patent Grant
Low-staining adhesive sheets and method for removing resist material
- Patent number 6,602,599
- Issue date Aug 5, 2003
- Nitto Denko Corporation
- Eiji Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the removal of resist material
- Patent number 6,565,704
- Issue date May 20, 2003
- Nitto Denko Corporation
- Eiji Toyoda
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITION AND BIOSENSOR
- Publication number 20220130569
- Publication date Apr 28, 2022
- Nitto Denko Corporation
- Eiji TOYODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCHABLE BIOSENSOR
- Publication number 20200289058
- Publication date Sep 17, 2020
- NITTO DENKO CORPORATION
- Shigeyasu MORI
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITION AND BIOSENSOR
- Publication number 20200286641
- Publication date Sep 10, 2020
- NITTO DENKO CORPORATION
- Eiji TOYODA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BIOSENSOR
- Publication number 20200187859
- Publication date Jun 18, 2020
- NITTO DENKO CORPORATION
- Ryoma YOSHIOKA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LAMINATE PATCHABLE LIVING BODY
- Publication number 20190254880
- Publication date Aug 22, 2019
- Nitto Denko Corporation
- Naoya SUGIMOTO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LAMINATE PATCHABLE LIVING BODY
- Publication number 20190247534
- Publication date Aug 15, 2019
- Nitto Denko Corporation
- Eiji TOYODA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PRODUCING METHOD OF WIRED CIRCUIT BOARD
- Publication number 20180199443
- Publication date Jul 12, 2018
- Nitto Denko Corporation
- Keisuke OKUMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20180192948
- Publication date Jul 12, 2018
- Nitto Denko Corporation
- Keisuke OKUMURA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20160269000
- Publication date Sep 15, 2016
- NITTO DENKO CORPORATION
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...
- Publication number 20160211228
- Publication date Jul 21, 2016
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD F...
- Publication number 20160060450
- Publication date Mar 3, 2016
- NITTO DENKO CORPORATION
- Eiji Toyoda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION
- Publication number 20140311525
- Publication date Oct 23, 2014
- Nitto Denko Corporation
- Makoto NAMIKAWA
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION
- Publication number 20140311666
- Publication date Oct 23, 2014
- Nitto Denko Corporation
- Makoto NAMIKAWA
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
THERMALLY-DETACHABLE SHEET
- Publication number 20140249269
- Publication date Sep 4, 2014
- Daisuke Uenda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LAMINATE
- Publication number 20140106133
- Publication date Apr 17, 2014
- Nitto Denko Corporation
- Tsuyoshi Torinari
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-S...
- Publication number 20140061955
- Publication date Mar 6, 2014
- Nitto Denko Corporation
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEM...
- Publication number 20140042645
- Publication date Feb 13, 2014
- Nitto Denko Corporation
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RESIN SHEET, METHOD FOR PRODUCING ELECTRONIC COMPONENT PACK...
- Publication number 20140008821
- Publication date Jan 9, 2014
- Eiji Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130288428
- Publication date Oct 31, 2013
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION SHEET FOR ENCAPSULATING ELECTRONIC PARTS AND METH...
- Publication number 20130185934
- Publication date Jul 25, 2013
- Nitto Denko Corporation
- Eiji TOYODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET FOR HOLLOW ENCAPSULATION AND PRODUCTION METHOD FOR THE...
- Publication number 20130183469
- Publication date Jul 18, 2013
- Nitto Denko Corporation
- Yusaku SHIMIZU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOBILE TERMINAL POWER RECEIVING MODULE UTILIZING WIRELESS POWER TRA...
- Publication number 20130175984
- Publication date Jul 11, 2013
- Nitto Denko Corporation
- Hiroshi Yamazaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130157419
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME, COLLECTOR...
- Publication number 20130139874
- Publication date Jun 6, 2013
- Nitto Denko Corporation
- Hiroshi YAMAZAKI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130078769
- Publication date Mar 28, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130078770
- Publication date Mar 28, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING SHEET AND ELECTRONIC DEVICE
- Publication number 20120296010
- Publication date Nov 22, 2012
- Nitto Denko Corporation
- Yuusaku SHIMIZU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN KNEADED MATERIAL AND SHEET
- Publication number 20120295997
- Publication date Nov 22, 2012
- Nitto Denko Corporation
- Tsuyoshi TORINARI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THERMOSETTING ENCAPSULATION ADHESIVE SHEET
- Publication number 20120153513
- Publication date Jun 21, 2012
- Nitto Denko Corporation
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PARTS DEVICE AND RESIN COMPOSIT...
- Publication number 20120055015
- Publication date Mar 8, 2012
- Nitto Denko Corporation
- Eiji TOYODA
- H01 - BASIC ELECTRIC ELEMENTS

Eiji Toyoda

Person

Patents Grantslast 30 patents

Electrically conductive composition and biosensor

Laminate patchable to living body

Patchable biosensor

Electrically conductive composition and biosensor

Laminate patchable to living body

Producing method of wired circuit board

Resin sheet for sealing electronic device and method for manufactur...

Wired circuit board

Thermally curable resin sheet for sealing semiconductor chip, and m...

Mobile terminal power receiving module utilizing wireless power tra...

Thermosetting resin sheet for sealing electronic component, resin-s...

Label sheet for cleaning and conveying member having cleaning function

Method for manufacturing electronic parts device and resin composit...

Thermosetting encapsulation adhesive sheet

Sealing resin sheet, method for producing electronic component pack...

Method for producing semiconductor device

Method for producing semiconductor device

Manufacturing method for semiconductor device

Epoxy resin composition for semiconductor encapsulation and semicon...

Cleaning sheet and method of cleaning substrate processing equipment

Cleaning sheet, conveying member using the same, and substrate proc...

Cleaning sheet, conveying member using the same, and substrate proc...

Cleaning member and cleaning method

Epoxy resin composition for semiconductor encapsulation and semicon...

Method for producing epoxy resin composition for semiconductor enca...

Cleaning sheet, conveying member using the same, and substrate proc...

Organic electroluminescence device and method for producing the same

Method for removing resist material

Low-staining adhesive sheets and method for removing resist material

Process for the removal of resist material

Patents Applicationslast 30 patents

ELECTRICALLY CONDUCTIVE COMPOSITION AND BIOSENSOR

PATCHABLE BIOSENSOR

ELECTRICALLY CONDUCTIVE COMPOSITION AND BIOSENSOR

BIOSENSOR

LAMINATE PATCHABLE LIVING BODY

LAMINATE PATCHABLE LIVING BODY

PRODUCING METHOD OF WIRED CIRCUIT BOARD

WIRED CIRCUIT BOARD

RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTUR...

THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...

SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD F...

LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION

LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION

THERMALLY-DETACHABLE SHEET

LAMINATE

THERMOSETTING RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-S...

RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEM...

SEALING RESIN SHEET, METHOD FOR PRODUCING ELECTRONIC COMPONENT PACK...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

RESIN COMPOSITION SHEET FOR ENCAPSULATING ELECTRONIC PARTS AND METH...

RESIN SHEET FOR HOLLOW ENCAPSULATION AND PRODUCTION METHOD FOR THE...

MOBILE TERMINAL POWER RECEIVING MODULE UTILIZING WIRELESS POWER TRA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CONDUCTIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME, COLLECTOR...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ENCAPSULATING SHEET AND ELECTRONIC DEVICE

RESIN KNEADED MATERIAL AND SHEET

THERMOSETTING ENCAPSULATION ADHESIVE SHEET

METHOD FOR MANUFACTURING ELECTRONIC PARTS DEVICE AND RESIN COMPOSIT...