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Kai, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
9,231,017
Issue date
Jan 5, 2016
Renesas Electronics Corporation
Eiji Wada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
8,722,449
Issue date
May 13, 2014
Renesas Electronics Corporation
Eiji Wada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing method of die pick-up from wafer
Patent number
8,211,261
Issue date
Jul 3, 2012
Renesas Electronics Corporation
Hiroshi Maki
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Manufacturing method of solid-state image pickup device
Patent number
8,033,446
Issue date
Oct 11, 2011
Renesas Electronics Corporation
Eiji Wada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor manufacturing method of die pick-up from wafer
Patent number
7,759,164
Issue date
Jul 20, 2010
Renesas Technology Corp.
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing method of die pick-up from wafer
Patent number
7,498,241
Issue date
Mar 3, 2009
Renesas Technology Corp.
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20140213009
Publication date
Jul 31, 2014
RENESAS ELECTRONICS CORPORATION
Eiji WADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20120225514
Publication date
Sep 6, 2012
Renesas Electronics Corporation
Eiji WADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SOLID-STATE IMAGE PICKUP DEVICE
Publication number
20110084118
Publication date
Apr 14, 2011
RENESAS TECHNOLOGY CORP.
Eiji WADA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER
Publication number
20100279465
Publication date
Nov 4, 2010
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER
Publication number
20090170290
Publication date
Jul 2, 2009
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor manufacturing method of die-pick-up from wafer
Publication number
20060166466
Publication date
Jul 27, 2006
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS