Eiji Watanabe

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing water-absorbent carrier
- Patent number 10,258,702
- Issue date Apr 16, 2019
- Terumo Kabushiki Kaisha
- Eiji Watanabe
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Syringe with hanging tag
- Patent number 9,962,491
- Issue date May 8, 2018
- Terumo Kabushiki Kaisha
- Eiji Watanabe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Gasket for syringe and syringe having gasket
- Patent number 9,345,837
- Issue date May 24, 2016
- Terumo Kabushiki Kaisha
- Aiko Horiuchi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Gasket for syringe and syringe having gasket
- Patent number 8,968,260
- Issue date Mar 3, 2015
- Terumo Kabushiki Kaisha
- Aiko Horiuchi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Medical appliance having a slidable coating layer and syringe
- Patent number 8,748,544
- Issue date Jun 10, 2014
- Terumo Kabushiki Kaisha
- Yoshihiko Abe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Medical appliance having a slidable coating layer and syringe
- Patent number 8,742,032
- Issue date Jun 3, 2014
- Terumo Kabushiki Kaisha
- Yoshihiko Abe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,420,522
- Issue date Apr 16, 2013
- Fujitsu Semiconductor Limited
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactor employing high-temperature air combustion technology
- Patent number 8,403,662
- Issue date Mar 26, 2013
- CHIYODA CORPORATION
- Tomoyuki Mikuriya
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Grant
Multilayer wiring board and its manufacturing method
- Patent number 7,915,538
- Issue date Mar 29, 2011
- Fujitsu Semiconductor Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,754,534
- Issue date Jul 13, 2010
- Fujitsu Semiconductor Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alkali soluble polymer and positive working photosensitive resin co...
- Patent number 7,670,745
- Issue date Mar 2, 2010
- Chisso Corporation
- Tomohiro Etou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,417,326
- Issue date Aug 26, 2008
- Fujitsu Limited
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and its manufacturing method
- Patent number 7,355,124
- Issue date Apr 8, 2008
- Fujitsu Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,276,386
- Issue date Oct 2, 2007
- Fujitsu Limited
- Katsumi Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,095,045
- Issue date Aug 22, 2006
- Fujitsu Limited
- Shuichi Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IP key management mechanism with divergence barrier increasing entr...
- Patent number 6,917,685
- Issue date Jul 12, 2005
- Meteora System Co., Ltd.
- Eiji Watanabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming a device substrate and semiconductor package incl...
- Patent number 6,905,951
- Issue date Jun 14, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,794,273
- Issue date Sep 21, 2004
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package including forming pyramid mount pr...
- Patent number 6,781,224
- Issue date Aug 24, 2004
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder jointing system, solder jointing method, semiconductor devic...
- Patent number 6,732,911
- Issue date May 11, 2004
- Fujitsu Limited
- Hirohisa Matsuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Perforated sleeve connector
- Patent number 6,712,522
- Issue date Mar 30, 2004
- Oudensha Co., Ltd.
- Eiji Watanabe
- G02 - OPTICS
Information Patent Grant
Photosensitive polymide precursor resin composition
- Patent number 6,664,021
- Issue date Dec 16, 2003
- Chisso Corporation
- Hirotoshi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 6,614,113
- Issue date Sep 2, 2003
- Fujitsu Limited
- Eiji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method having a step of forming...
- Patent number 6,566,239
- Issue date May 20, 2003
- Fujitsu Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with film to increase adhesion of the bump
- Patent number 6,522,016
- Issue date Feb 18, 2003
- Fujitsu Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bumps for pads
- Patent number 6,472,763
- Issue date Oct 29, 2002
- Fujitsu Limited
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device as an object of thickness reduction
- Patent number 6,462,415
- Issue date Oct 8, 2002
- Fujitsu Limited
- Masahiko Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing solder bumps and solder joints using formic...
- Patent number 6,344,407
- Issue date Feb 5, 2002
- Fujitsu Limited
- Hirohisa Matsuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a lead portion with outer connecting te...
- Patent number 6,255,740
- Issue date Jul 3, 2001
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with pad structure
- Patent number 6,232,147
- Issue date May 15, 2001
- Fujitsu Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TWO-PARTS-ARE-ONE PASSWORD
- Publication number 20170237564
- Publication date Aug 17, 2017
- METEORA SYSTEM CO., LTD.
- Eiji WATANABE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WATER-ABSORBENT CARRIER, METHOD FOR MANUFACTURING WATER-ABSORBENT C...
- Publication number 20160206765
- Publication date Jul 21, 2016
- Terumo Kabushiki Kaisha
- Eiji WATANABE
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SYRINGE WITH HANGING TAG
- Publication number 20150352286
- Publication date Dec 10, 2015
- TERUMO KABUSHIKI KAISHA
- Eiji WATANABE
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
GASKET FOR SYRINGE AND SYRINGE HAVING GASKET
- Publication number 20150133873
- Publication date May 14, 2015
- TERUMO KABUSHIKI KAISHA
- Aiko HORIUCHI
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MEDICAL APPLIANCE HAVING A SLIDABLE COATING LAYER AND SYRINGE
- Publication number 20140031764
- Publication date Jan 30, 2014
- TERUMO KABUSHIKI KAISHA
- Yoshihiko ABE
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MEDICAL APPLIANCE HAVING A SLIDABLE COATING LAYER AND SYRINGE
- Publication number 20130030380
- Publication date Jan 31, 2013
- TERUMO KABUSHIKI KAISHA
- Yoshihiko ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
GASKET FOR SYRINGE AND SYRINGE HAVING GASKET
- Publication number 20100324501
- Publication date Dec 23, 2010
- TERUMO KABUSHIKI KAISHA
- Aiko HORIUCHI
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
REACTOR EMPLOYING HIGH-TEMPERATURE AIR COMBUSTION TECHNOLOGY
- Publication number 20100143854
- Publication date Jun 10, 2010
- CHIYODA CORPORATION
- Tomoyuki Mikuriya
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Application
POSITIVE PHOTOSENSITIVE POLYMER COMPOSITION
- Publication number 20090191386
- Publication date Jul 30, 2009
- CHISSO CORPORATION
- Toshiyuki TAKAHASHI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20080293234
- Publication date Nov 27, 2008
- FUJITSU LIMITED
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20080261336
- Publication date Oct 23, 2008
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alkali soluble polymer and positive working photosensitive resin co...
- Publication number 20080131813
- Publication date Jun 5, 2008
- Chisso Corporation
- Tomohiro Etou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD
- Publication number 20080124529
- Publication date May 29, 2008
- Fujitsu Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20070138635
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring board and its manufacturing method
- Publication number 20060219429
- Publication date Oct 5, 2006
- FUJITSU LIMITED
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and semiconductor-device manufacturing method
- Publication number 20060214296
- Publication date Sep 28, 2006
- FUJITSU LIMITED
- Tadahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20060175686
- Publication date Aug 10, 2006
- FUJITSU LIMITED
- Koichi Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050151250
- Publication date Jul 14, 2005
- Shuichi Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050006792
- Publication date Jan 13, 2005
- FUJITSU LIMITED
- Katsumi Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040232549
- Publication date Nov 25, 2004
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device substrate and manufacturing method thereof and...
- Publication number 20040224499
- Publication date Nov 11, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030219969
- Publication date Nov 27, 2003
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device substrate and manufacturing method thereof and...
- Publication number 20030160325
- Publication date Aug 28, 2003
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Perforated sleeve connector
- Publication number 20030059169
- Publication date Mar 27, 2003
- Eiji Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solder jointing system, solder jointing method, semiconductor devic...
- Publication number 20020130164
- Publication date Sep 19, 2002
- FUJITSU LIMITED
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMPS FOR PADS
- Publication number 20020125569
- Publication date Sep 12, 2002
- FUJITSU LIMITED
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20020102832
- Publication date Aug 1, 2002
- KATSUMI MIYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method having a step of forming...
- Publication number 20020076908
- Publication date Jun 20, 2002
- FUJITSU LIMITED
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of producing slit-formed sleeve connector
- Publication number 20020056643
- Publication date May 16, 2002
- Eiji Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20020003302
- Publication date Jan 10, 2002
- Eiji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Eiji Watanabe

Person

Patents Grantslast 30 patents

Method for manufacturing water-absorbent carrier

Syringe with hanging tag

Gasket for syringe and syringe having gasket

Gasket for syringe and syringe having gasket

Medical appliance having a slidable coating layer and syringe

Medical appliance having a slidable coating layer and syringe

Semiconductor device and manufacturing method of the same

Reactor employing high-temperature air combustion technology

Multilayer wiring board and its manufacturing method

Semiconductor device and manufacturing method thereof

Alkali soluble polymer and positive working photosensitive resin co...

Semiconductor device and manufacturing method of the same

Multilayer wiring board and its manufacturing method

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

IP key management mechanism with divergence barrier increasing entr...

Method of forming a device substrate and semiconductor package incl...

Semiconductor device and manufacturing method thereof

Semiconductor device and package including forming pyramid mount pr...

Solder jointing system, solder jointing method, semiconductor devic...

Perforated sleeve connector

Photosensitive polymide precursor resin composition

Semiconductor device and method for producing the same

Semiconductor device manufacturing method having a step of forming...

Interconnection structure with film to increase adhesion of the bump

Semiconductor device with bumps for pads

Semiconductor device as an object of thickness reduction

Method of manufacturing solder bumps and solder joints using formic...

Semiconductor device having a lead portion with outer connecting te...

Method for manufacturing semiconductor device with pad structure

Patents Applicationslast 30 patents

TWO-PARTS-ARE-ONE PASSWORD

WATER-ABSORBENT CARRIER, METHOD FOR MANUFACTURING WATER-ABSORBENT C...

SYRINGE WITH HANGING TAG

GASKET FOR SYRINGE AND SYRINGE HAVING GASKET

MEDICAL APPLIANCE HAVING A SLIDABLE COATING LAYER AND SYRINGE

MEDICAL APPLIANCE HAVING A SLIDABLE COATING LAYER AND SYRINGE

GASKET FOR SYRINGE AND SYRINGE HAVING GASKET

REACTOR EMPLOYING HIGH-TEMPERATURE AIR COMBUSTION TECHNOLOGY

POSITIVE PHOTOSENSITIVE POLYMER COMPOSITION

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method thereof

Alkali soluble polymer and positive working photosensitive resin co...

MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD

Semiconductor device and manufacturing method of the same

Multilayer wiring board and its manufacturing method

Semiconductor device and semiconductor-device manufacturing method

Semiconductor device and fabrication method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device substrate and manufacturing method thereof and...

Semiconductor device and manufacturing method thereof

Semiconductor device substrate and manufacturing method thereof and...

Perforated sleeve connector

Solder jointing system, solder jointing method, semiconductor devic...

SEMICONDUCTOR DEVICE WITH BUMPS FOR PADS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device manufacturing method having a step of forming...

Process of producing slit-formed sleeve connector

Semiconductor device and method for producing the same