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Patents Grantslast 30 patents

Information Patent Grant
Circuit pattern for multi-layer circuit board for mounting electron...
- Patent number 6,452,115
- Issue date Sep 17, 2002
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board with particular pad spacing
- Patent number 6,229,099
- Issue date May 8, 2001
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board
- Patent number 6,194,668
- Issue date Feb 27, 2001
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer circuit board
- Publication number 20010009203
- Publication date Jul 26, 2001
- Shinko Electric Industries, Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS