Eiji Yoshikawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of a semiconductor pressure sensor having firs...
- Patent number 12,061,130
- Issue date Aug 13, 2024
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor
- Patent number 10,663,366
- Issue date May 26, 2020
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor pressure sensor
- Patent number 10,589,981
- Issue date Mar 17, 2020
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor differential pressure sensor and manufacturing method...
- Patent number 10,260,976
- Issue date Apr 16, 2019
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOI wafer, manufacturing method therefor, and MEMS device
- Patent number 9,266,715
- Issue date Feb 23, 2016
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOI wafer, manufacturing method therefor, and MEMS device
- Patent number 9,212,049
- Issue date Dec 15, 2015
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor pressure sensor
- Patent number 8,710,600
- Issue date Apr 29, 2014
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor pressure sensor and method of manufacturing semicondu...
- Patent number 8,647,908
- Issue date Feb 11, 2014
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor strain sensor
- Patent number 7,562,582
- Issue date Jul 21, 2009
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- G01 - MEASURING TESTING
Information Patent Grant
Acceleration sensor
- Patent number 6,955,086
- Issue date Oct 18, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Eiji Yoshikawa
- G01 - MEASURING TESTING
Information Patent Grant
Angular velocity sensor
- Patent number 6,584,840
- Issue date Jul 1, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiro Tsugai
- G01 - MEASURING TESTING
Information Patent Grant
Pressure switch
- Patent number 6,194,678
- Issue date Feb 27, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Eiji Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor accelerometer switch
- Patent number 6,078,016
- Issue date Jun 20, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Eiji Yoshikawa
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20220099512
- Publication date Mar 31, 2022
- Mitsubishi Electric Corporation
- Eiji YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR
- Publication number 20190177154
- Publication date Jun 13, 2019
- Mitsubishi Electric Corporation
- Eiji YOSHIKAWA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR
- Publication number 20190178739
- Publication date Jun 13, 2019
- Mitsubishi Electric Corporation
- Eiji YOSHIKAWA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DIFFERENTIAL PRESSURE SENSOR AND MANUFACTURING METHOD...
- Publication number 20180120184
- Publication date May 3, 2018
- Mitsubishi Electric Corporation
- Eiji YOSHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR
- Publication number 20170113917
- Publication date Apr 27, 2017
- Mitsubishi Electric Corporation
- Eiji YOSHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE
- Publication number 20140175573
- Publication date Jun 26, 2014
- Mitsubishi Electric Corporation
- Eiji YOSHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE
- Publication number 20130277675
- Publication date Oct 24, 2013
- Eiji YOSHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR AND METHOD OF MANUFACTURING SEMICONDU...
- Publication number 20130105922
- Publication date May 2, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Eiji YOSHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR
- Publication number 20110278685
- Publication date Nov 17, 2011
- Mitsubishi Electric Corporation
- Eiji YOSHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor strain sensor
- Publication number 20080094167
- Publication date Apr 24, 2008
- MITSUBISHI ELECTRIC CORPORATION
- Eiji Yoshikawa
- G01 - MEASURING TESTING
Information Patent Application
Acceleration sensor
- Publication number 20040079154
- Publication date Apr 29, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Eiji Yoshikawa
- G01 - MEASURING TESTING
Information Patent Application
Accleration sensor
- Publication number 20040025591
- Publication date Feb 12, 2004
- Eiji Yoshikawa
- G01 - MEASURING TESTING
Information Patent Application
Angular velocity sensor
- Publication number 20020139187
- Publication date Oct 3, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masahiro Tsugai
- G01 - MEASURING TESTING

Eiji Yoshikawa

Person

Patents Grantslast 30 patents

Manufacturing method of a semiconductor pressure sensor having firs...

Semiconductor pressure sensor

Semiconductor pressure sensor

Semiconductor differential pressure sensor and manufacturing method...

SOI wafer, manufacturing method therefor, and MEMS device

SOI wafer, manufacturing method therefor, and MEMS device

Semiconductor pressure sensor

Semiconductor pressure sensor and method of manufacturing semicondu...

Semiconductor strain sensor

Acceleration sensor

Angular velocity sensor

Pressure switch

Semiconductor accelerometer switch

Patents Applicationslast 30 patents

SEMICONDUCTOR PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PRESSURE SENSOR

SEMICONDUCTOR PRESSURE SENSOR

SEMICONDUCTOR DIFFERENTIAL PRESSURE SENSOR AND MANUFACTURING METHOD...

SEMICONDUCTOR PRESSURE SENSOR

SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE

SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE

SEMICONDUCTOR PRESSURE SENSOR AND METHOD OF MANUFACTURING SEMICONDU...

SEMICONDUCTOR PRESSURE SENSOR

Semiconductor strain sensor

Acceleration sensor

Accleration sensor

Angular velocity sensor