Eiju Shitama

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Fukuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component mounting device and semiconductor device inclu...
- Patent number 9,723,718
- Issue date Aug 1, 2017
- Mitsubishi Electric Corporation
- Taichi Obara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 5,841,189
- Issue date Nov 24, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Eiju Shitama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT MOUNTING DEVICE AND SEMICONDUCTOR DEVICE INCLU...
- Publication number 20150163916
- Publication date Jun 11, 2015
- Mitsubishi Electric Corporation
- Taichi OBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR