Eikichi Satou

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Oyama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of producing flexible printed-circuit board covered with cov...
- Patent number 5,234,522
- Issue date Aug 10, 1993
- Hitachi Chemical Company, Inc.
- Masakatsu Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat resistant adhesive composition and bonding method using the same
- Patent number 5,171,826
- Issue date Dec 15, 1992
- Hitachi Chemical Company, Ltd.
- Junichi Imaizumi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat resistant adhesive composition and bonding method using the same
- Patent number 5,089,346
- Issue date Feb 18, 1992
- Hitachi Chemical Company, Ltd.
- Junichi Imaizumi
- B32 - LAYERED PRODUCTS