Eileen Valdez

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South Jordan, UT, US

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Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio trench structures with void-free fill material
- Patent number 8,198,196
- Issue date Jun 12, 2012
- Fairchild Semiconductor Corporation
- James J. Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio trench structures with void-free fill material
- Patent number 7,956,411
- Issue date Jun 7, 2011
- Fairchild Semiconductor Corporation
- James J. Murphy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH ASPECT RATIO TRENCH STRUCTURES WITH VOID-FREE FILL MATERIAL
- Publication number 20120142155
- Publication date Jun 7, 2012
- JAMES J. MURPHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO TRENCH STRUCTURES WITH VOID-FREE FILL MATERIAL
- Publication number 20100044785
- Publication date Feb 25, 2010
- JAMES J. MURPHY
- H01 - BASIC ELECTRIC ELEMENTS