Ein Sun NG

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Pulau Pinang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe packages having enhanced ground-bond reliability
- Patent number 8,093,707
- Issue date Jan 10, 2012
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DAP GROUND BOND ENHANCEMENT
- Publication number 20110140253
- Publication date Jun 16, 2011
- National Semiconductor Corporation
- Shaw Wei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY
- Publication number 20110089556
- Publication date Apr 21, 2011
- National Semiconductor Corporation
- Shaw Wei LEE
- H01 - BASIC ELECTRIC ELEMENTS