Eisuke Tachibana

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Gifu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Organic-inorganic composite graded material, method for preparation...
- Patent number 6,737,145
- Issue date May 18, 2004
- Ube Nitto Kasei Co., Ltd.
- Toshiya Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD
- Publication number 20210153348
- Publication date May 20, 2021
- UBE EXSYMO CO., LTD.
- Eisuke TACHIBANA
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD
- Publication number 20170318670
- Publication date Nov 2, 2017
- UBE EXSYMO CO., LTD.
- Eisuke TACHIBANA
- B32 - LAYERED PRODUCTS