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Bangkok, TH
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Patents Grants
last 30 patents
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Patent Grant
Die separation using adhesive-layer laser scribing
Patent number
10,607,861
Issue date
Mar 31, 2020
NXP B.V.
Siriluck Wongratanaporngoorn
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
NON-LEADED DEVICE SINGULATION
Publication number
20190252256
Publication date
Aug 15, 2019
NXP B.V.
Pimpa Boonyatee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME WITH PLATED LEAD TIPS
Publication number
20190229044
Publication date
Jul 25, 2019
NXP B.V.
AMORNTHEP SAIYAJITARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE SEPARATION USING ADHESIVE-LAYER LASER SCRIBING
Publication number
20190164784
Publication date
May 30, 2019
NXP B.V.
Siriluck Wongratanaporngoorn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR LEAD FRAME WITH MACHINE READABLE MARK
Publication number
20180226353
Publication date
Aug 9, 2018
NXP B.V.
Ekapong Tangpattanasaeree
H01 - BASIC ELECTRIC ELEMENTS