Ekaterina Mikhaylichenko

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate handling in a modular polishing system with single substr...
- Patent number 12,198,944
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Grant
Roller for location-specific wafer polishing
- Patent number 12,194,591
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Grant
Roller for location-specific wafer polishing
- Patent number 12,138,733
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Grant
Cleaning method with in-line SPM processing
- Patent number 12,051,599
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Brian J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface cleaning with directed high pressure chemistry
- Patent number 12,027,382
- Issue date Jul 2, 2024
- Applied Materials, Inc.
- Brian K. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad carrier for horizontal pre-clean module
- Patent number 11,942,319
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Edward Golubovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spray system for slurry reduction during chemical mechanical polish...
- Patent number 11,819,976
- Issue date Nov 21, 2023
- Applied Materials, Inc.
- Chih Chung Chou
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via variable relative velocity of a wafer
- Patent number 11,764,069
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Non-contact clean module
- Patent number 11,721,563
- Issue date Aug 8, 2023
- Applied Materials, Inc.
- Jagan Rangarajan
- B08 - CLEANING
Information Patent Grant
Cleaning system with in-line SPM processing
- Patent number 11,682,567
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Brian J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-contact clean module
- Patent number 11,289,347
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Jagan Rangarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-contact clean module
- Patent number 11,158,524
- Issue date Oct 26, 2021
- Applied Materials, Inc.
- Jagan Rangarajan
- B08 - CLEANING
Information Patent Grant
Thin plastic polishing article for CMP applications
- Patent number 10,786,885
- Issue date Sep 29, 2020
- Applied Materials, Inc.
- Robert D. Tolles
- B24 - GRINDING POLISHING
Information Patent Grant
Spray bar design for uniform liquid flow distribution on a substrate
- Patent number 10,751,738
- Issue date Aug 25, 2020
- Applied Materials, Inc.
- Jagan Rangarajan
- B08 - CLEANING
Information Patent Grant
Systems and methods for rinsing and drying substrates
- Patent number 9,984,867
- Issue date May 29, 2018
- Applied Materials, Inc.
- Ekaterina Mikhaylichenko
- B08 - CLEANING
Information Patent Grant
Substrate rinsing systems and methods
- Patent number 9,859,135
- Issue date Jan 2, 2018
- Applied Materials, Inc.
- Jonathan S. Frankel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CMP WITH INDIVIDUALLY ROTATABLE PLATENS
- Publication number 20250114899
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...
- Publication number 20250114897
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL
- Publication number 20250114898
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL P...
- Publication number 20250114901
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP
- Publication number 20250114896
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL
- Publication number 20250108473
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Andrew J. Nagengast
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD WITH FLEXURE EXTENDING THROUGH PRESSURE CHAMBER
- Publication number 20250108479
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Andrew J. Nagengast
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES
- Publication number 20250108477
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Application
DROPLET JET NOZZLE DESIGN
- Publication number 20240390924
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Manikandan JAYARAMAN
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DROPLET JET NOZZLE DESIGN
- Publication number 20240395579
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Manikandan JAYARAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI HEAD PAD CONDITIONING APPARATUS AND METHOD OF USE
- Publication number 20240383099
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Christopher Heung-Gyun LEE
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY
- Publication number 20240253183
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Priscilla Michelle Diep LAROSA
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED CLEAN AND DRY MODULE FOR CLEANING A SUBSTRATE
- Publication number 20240222152
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Jason A. RYE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF CARRIER HEAD SWEEP AND PLATEN SHAPE
- Publication number 20240139906
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
SPRAY SYSTEM FOR SLURRY REDUCTION DURING CHEMICAL MECHANICAL POLISH...
- Publication number 20240042571
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Chih Chung CHOU
- B24 - GRINDING POLISHING
Information Patent Application
MINIMIZING SUBSTRATE BOW DURING POLISHING
- Publication number 20240033878
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Eric L. Lau
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER
- Publication number 20240017376
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING
- Publication number 20240017371
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM
- Publication number 20230356354
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD WITH LOCAL INNER RING DOWNFORCE CONTROL
- Publication number 20230356355
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
CLEANING METHOD WITH IN-LINE SPM PROCESSING
- Publication number 20230290652
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Brian J. Brown
- B08 - CLEANING
Information Patent Application
PAD CARRIER ASSEMBLY FOR HORIZONTAL PRE-CLEAN MODULE
- Publication number 20230264319
- Publication date Aug 24, 2023
- Applied Materials, Inc.
- Edward GOLUBOVSKY
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE CLEANING WITH DIRECTED HIGH PRESSURE CHEMISTRY
- Publication number 20230178388
- Publication date Jun 8, 2023
- Applied Materials, Inc.
- Brian K. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SLURRY DISPENSE NOZZLE
- Publication number 20230130235
- Publication date Apr 27, 2023
- Applied Materials, Inc.
- Chih Chung Chou
- B24 - GRINDING POLISHING
Information Patent Application
SPRAY SYSTEM FOR SLURRY REDUCTION DURING CHEMICAL MECHANICAL POLISH...
- Publication number 20220410336
- Publication date Dec 29, 2022
- Applied Materials, Inc.
- Chih Chung Chou
- B24 - GRINDING POLISHING
Information Patent Application
ASYMMETRY CORRECTION VIA VARIABLE RELATIVE VELOCITY OF A WAFER
- Publication number 20220379428
- Publication date Dec 1, 2022
- Applied Materials, Inc.
- Jimin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY-BASED TEMPERATURE CONTROL FOR CMP
- Publication number 20220281070
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE CONTROL WITH INTRA-LAYER TRANSITION DURING CMP
- Publication number 20220281061
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Application
ROLLER FOR LOCATION-SPECIFIC WAFER POLISHING
- Publication number 20220281062
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Application
PAD CARRIER FOR HORIZONTAL PRE-CLEAN MODULE
- Publication number 20220199396
- Publication date Jun 23, 2022
- Applied Materials, Inc.
- Edward GOLUBOVSKY
- H01 - BASIC ELECTRIC ELEMENTS

Ekaterina Mikhaylichenko

Person

Patents Grantslast 30 patents

Substrate handling in a modular polishing system with single substr...

Roller for location-specific wafer polishing

Roller for location-specific wafer polishing

Cleaning method with in-line SPM processing

Surface cleaning with directed high pressure chemistry

Pad carrier for horizontal pre-clean module

Spray system for slurry reduction during chemical mechanical polish...

Asymmetry correction via variable relative velocity of a wafer

Non-contact clean module

Cleaning system with in-line SPM processing

Non-contact clean module

Non-contact clean module

Thin plastic polishing article for CMP applications

Spray bar design for uniform liquid flow distribution on a substrate

Systems and methods for rinsing and drying substrates

Substrate rinsing systems and methods

Patents Applicationslast 30 patents

CMP WITH INDIVIDUALLY ROTATABLE PLATENS

EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...

RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL

GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL P...

INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP

POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL

POLISHING HEAD WITH FLEXURE EXTENDING THROUGH PRESSURE CHAMBER

CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES

DROPLET JET NOZZLE DESIGN

DROPLET JET NOZZLE DESIGN

MULTI HEAD PAD CONDITIONING APPARATUS AND METHOD OF USE

APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY

INTEGRATED CLEAN AND DRY MODULE FOR CLEANING A SUBSTRATE

CONTROL OF CARRIER HEAD SWEEP AND PLATEN SHAPE

SPRAY SYSTEM FOR SLURRY REDUCTION DURING CHEMICAL MECHANICAL POLISH...

MINIMIZING SUBSTRATE BOW DURING POLISHING

MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER

MONITORING THICKNESS IN FACE-UP POLISHING

COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM

POLISHING HEAD WITH LOCAL INNER RING DOWNFORCE CONTROL

CLEANING METHOD WITH IN-LINE SPM PROCESSING

PAD CARRIER ASSEMBLY FOR HORIZONTAL PRE-CLEAN MODULE

SURFACE CLEANING WITH DIRECTED HIGH PRESSURE CHEMISTRY

POLISHING SLURRY DISPENSE NOZZLE

SPRAY SYSTEM FOR SLURRY REDUCTION DURING CHEMICAL MECHANICAL POLISH...

ASYMMETRY CORRECTION VIA VARIABLE RELATIVE VELOCITY OF A WAFER

SLURRY-BASED TEMPERATURE CONTROL FOR CMP

TEMPERATURE CONTROL WITH INTRA-LAYER TRANSITION DURING CMP

ROLLER FOR LOCATION-SPECIFIC WAFER POLISHING

PAD CARRIER FOR HORIZONTAL PRE-CLEAN MODULE