Ela Mia Cadag

Person

Calamba City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 11,929,259
- Issue date Mar 12, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapeless leadframe package with exposed integrated circuit die
- Patent number 11,916,090
- Issue date Feb 27, 2024
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interlocking leads and manufacturing the same
- Patent number 11,557,548
- Issue date Jan 17, 2023
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 11,552,007
- Issue date Jan 10, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package with wettable flanks
- Patent number 11,069,601
- Issue date Jul 20, 2021
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,957,634
- Issue date Mar 23, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,910,295
- Issue date Feb 2, 2021
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interlocking leads and manufacturing the same
- Patent number 10,903,172
- Issue date Jan 26, 2021
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,615,104
- Issue date Apr 7, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,541,196
- Issue date Jan 21, 2020
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interlocking leads and manufacturing the same
- Patent number 10,529,672
- Issue date Jan 7, 2020
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with backside protective layer during molding to prevent mo...
- Patent number 10,461,019
- Issue date Oct 29, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with backside protective layer during molding to prevent mo...
- Patent number 10,128,169
- Issue date Nov 13, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,109,563
- Issue date Oct 23, 2018
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,079,198
- Issue date Sep 18, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow over wire die attach film and conductive molding compound to p...
- Patent number 9,953,933
- Issue date Apr 24, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated heatsink
- Patent number 9,842,794
- Issue date Dec 12, 2017
- STMicroelectronics, Inc.
- Ela Mia Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive clip with flexible leads...
- Patent number 9,818,675
- Issue date Nov 14, 2017
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having exposed contact pads and leads sup...
- Patent number 9,324,643
- Issue date Apr 26, 2016
- STMicroelectronics, Inc.
- Ela Mia Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead frame contact solder balls and relat...
- Patent number 9,165,867
- Issue date Oct 20, 2015
- STMicroelectronics, Inc.
- Ela Mia Cadag
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20240178006
- Publication date May 30, 2024
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE
- Publication number 20220005857
- Publication date Jan 6, 2022
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20210313255
- Publication date Oct 7, 2021
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20210183750
- Publication date Jun 17, 2021
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME
- Publication number 20210118818
- Publication date Apr 22, 2021
- STMICROELECTRONICS, INC.
- Aaron Cadag.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
- Publication number 20200343168
- Publication date Oct 29, 2020
- STMicroelectronics, Inc.
- Ela Mia CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20200194355
- Publication date Jun 18, 2020
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...
- Publication number 20200135623
- Publication date Apr 30, 2020
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME
- Publication number 20200118944
- Publication date Apr 16, 2020
- STMicroelectronics, Inc.
- Aaron Cadag.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20190267311
- Publication date Aug 29, 2019
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME
- Publication number 20190067212
- Publication date Feb 28, 2019
- STMicroelectronics, Inc.
- Aaron Cadag.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20190043790
- Publication date Feb 7, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...
- Publication number 20190019745
- Publication date Jan 17, 2019
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...
- Publication number 20180358286
- Publication date Dec 13, 2018
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...
- Publication number 20180331020
- Publication date Nov 15, 2018
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20180190576
- Publication date Jul 5, 2018
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED HEATSINK
- Publication number 20170141014
- Publication date May 18, 2017
- STMICROELECTRONICS, INC.
- Ela Mia Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE CLIP WITH FLEXIBLE LEADS...
- Publication number 20160293523
- Publication date Oct 6, 2016
- STMICROELECTRONICS, INC.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS

Ela Mia Cadag

Person

Patents Grantslast 30 patents

Method for manufacturing leadless semiconductor package with wettab...

Tapeless leadframe package with exposed integrated circuit die

Package with interlocking leads and manufacturing the same

Modified leadframe design with adhesive overflow recesses

Leadless semiconductor package with wettable flanks

Modified leadframe design with adhesive overflow recesses

QFN pre-molded leadframe having a solder wettable sidewall on each...

Package with interlocking leads and manufacturing the same

Modified leadframe design with adhesive overflow recesses

QFN pre-molded leadframe having a solder wettable sidewall on each...

Package with interlocking leads and manufacturing the same

Package with backside protective layer during molding to prevent mo...

Package with backside protective layer during molding to prevent mo...

Modified leadframe design with adhesive overflow recesses

QFN pre-molded leadframe having a solder wettable sidewall on each...

Flow over wire die attach film and conductive molding compound to p...

Semiconductor package with integrated heatsink

Semiconductor device including conductive clip with flexible leads...

Integrated circuit device having exposed contact pads and leads sup...

Semiconductor device with lead frame contact solder balls and relat...

Patents Applicationslast 30 patents

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME

LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...

PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

PACKAGE WITH INTERLOCKING LEADS AND MANUFACTURING THE SAME

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...

QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...

PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MO...

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

SEMICONDUCTOR PACKAGE WITH INTEGRATED HEATSINK

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE CLIP WITH FLEXIBLE LEADS...