Elah Bozorg-Grayeli

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,984,377
- Issue date May 14, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,935,808
- Issue date Mar 19, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die with solderable thermal interface structures for assemblies...
- Patent number 11,923,267
- Issue date Mar 5, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon based polymer thermal interface materials with polymer chain...
- Patent number 11,881,440
- Issue date Jan 23, 2024
- Intel Corporation
- Marely E. Tejeda Ferrari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First-level integration of second-level thermal interface material...
- Patent number 11,881,438
- Issue date Jan 23, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with underfilled sealant
- Patent number 11,710,672
- Issue date Jul 25, 2023
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultraviolet (UV)-curable sealant in a microelectronic package
- Patent number 11,710,677
- Issue date Jul 25, 2023
- Intel Corporation
- Taylor William Gaines
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi-chip package with partial integrated heat spreader
- Patent number 11,004,768
- Issue date May 11, 2021
- Intel Corporation
- Muhammad S. Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with epoxy cured by ultraviolet laser
- Patent number 10,569,298
- Issue date Feb 25, 2020
- Intel Corporation
- Michael Greenley
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Two material high K thermal encapsulant system
- Patent number 10,475,715
- Issue date Nov 12, 2019
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20240136244
- Publication date Apr 25, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM ALLOYS AS FILLERS FOR POLYMER THERMAL INTERFACE MATERIALS
- Publication number 20220199489
- Publication date Jun 23, 2022
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20210305120
- Publication date Sep 30, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR ASSEMBLIES...
- Publication number 20210305119
- Publication date Sep 30, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20210305121
- Publication date Sep 30, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON BASED POLYMER THERMAL INTERFACE MATERIALS WITH POLYMER CHAIN...
- Publication number 20210265238
- Publication date Aug 26, 2021
- Intel Corporation
- Marely E. Tejeda Ferrari
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL...
- Publication number 20210225729
- Publication date Jul 22, 2021
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210134698
- Publication date May 6, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER
- Publication number 20210035886
- Publication date Feb 4, 2021
- Intel Corporation
- Muhammad S. Islam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRAVIOLET (UV)-CURABLE SEALANT IN A MICROELECTRONIC PACKAGE
- Publication number 20210013123
- Publication date Jan 14, 2021
- Intel Corporation
- Taylor William Gaines
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROELECTRONIC PACKAGE WITH UNDERFILLED SEALANT
- Publication number 20210013115
- Publication date Jan 14, 2021
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES
- Publication number 20200411395
- Publication date Dec 31, 2020
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH EPOXY CURED BY ULTRAVIOLET LASER
- Publication number 20190091722
- Publication date Mar 28, 2019
- Intel Corporation
- Michael Greenley
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM
- Publication number 20170170088
- Publication date Jun 15, 2017
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS

Elah Bozorg-Grayeli

Person

Patents Grantslast 30 patents

IC die and heat spreaders with solderable thermal interface structu...

Integrated circuit package lids with polymer features

IC die and heat spreaders with solderable thermal interface structu...

IC die with solderable thermal interface structures for assemblies...

Carbon based polymer thermal interface materials with polymer chain...

First-level integration of second-level thermal interface material...

Thermal interface structures for integrated circuit packages

Microelectronic package with underfilled sealant

Ultraviolet (UV)-curable sealant in a microelectronic package

Multi-chip package with partial integrated heat spreader

Substrate with epoxy cured by ultraviolet laser

Two material high K thermal encapsulant system

Patents Applicationslast 30 patents

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

GALLIUM ALLOYS AS FILLERS FOR POLYMER THERMAL INTERFACE MATERIALS

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

IC DIE WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR ASSEMBLIES...

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

CARBON BASED POLYMER THERMAL INTERFACE MATERIALS WITH POLYMER CHAIN...

FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL...

THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES

MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER

ULTRAVIOLET (UV)-CURABLE SEALANT IN A MICROELECTRONIC PACKAGE

MICROELECTRONIC PACKAGE WITH UNDERFILLED SEALANT

INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES

SUBSTRATE WITH EPOXY CURED BY ULTRAVIOLET LASER

TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM