Elie A. Maalouf

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including topside cooling interfaces and me...
- Patent number 11,990,872
- Issue date May 21, 2024
- NXP USA, INC.
- Geoffrey Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for sensing a current in a circuit
- Patent number 11,742,809
- Issue date Aug 29, 2023
- NXP USA, INC.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Systems and methods for calibrating temperature sensors
- Patent number 11,519,795
- Issue date Dec 6, 2022
- NXP USA, INC.
- Xu Jason Ma
- G01 - MEASURING TESTING
Information Patent Grant
Doherty power amplifiers and devices with low voltage driver stage...
- Patent number 11,515,842
- Issue date Nov 29, 2022
- NXP USA, INC.
- Lu Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wideband RF power splitters and amplifiers including wideband RF po...
- Patent number 11,342,887
- Issue date May 24, 2022
- NXP USA, INC.
- Hussain Hasanali Ladhani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for operating a bias controller for an amplifie...
- Patent number 11,194,357
- Issue date Dec 7, 2021
- NXP USA, INC.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Doherty amplifier with surface-mount packaged carrier and peaking a...
- Patent number 11,145,609
- Issue date Oct 12, 2021
- NXP USA, INC.
- Joseph Gerard Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-stage power amplifiers and devices with low-voltage driver...
- Patent number 11,128,269
- Issue date Sep 21, 2021
- NXP USA, INC.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiple-path RF amplifiers with angularly offset signal path direc...
- Patent number 11,108,362
- Issue date Aug 31, 2021
- NXP USA, INC.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact three-way Doherty amplifier module
- Patent number 11,050,388
- Issue date Jun 29, 2021
- NXP USA, INC.
- Lu Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Systems and methods for automatically biasing power amplifiers usin...
- Patent number 10,972,054
- Issue date Apr 6, 2021
- NXP USA, INC.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Amplifier die bond pad design and amplifier die arrangement for com...
- Patent number 10,903,182
- Issue date Jan 26, 2021
- NXP USA, INC.
- Lu Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,785,862
- Issue date Sep 22, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fast switching time division duplex operati...
- Patent number 10,742,173
- Issue date Aug 11, 2020
- NXP USA, INC.
- Elie Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Systems and methods for automatically biasing power amplifiers
- Patent number 10,608,595
- Issue date Mar 31, 2020
- NXP USA, INC.
- Elie Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiple-path RF amplifiers with angularly offset signal path direc...
- Patent number 10,566,935
- Issue date Feb 18, 2020
- NXP USA, INC.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,485,091
- Issue date Nov 19, 2019
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic modules including thermal extension levels and meth...
- Patent number 10,440,813
- Issue date Oct 8, 2019
- NXP USA, INC.
- Lu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Amplifiers and amplifier modules with shunt inductance circuits tha...
- Patent number 10,381,984
- Issue date Aug 13, 2019
- NXP USA, INC.
- Yu-Ting David Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,104,759
- Issue date Oct 16, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-path RF amplifiers with angularly offset signal path direc...
- Patent number 9,774,301
- Issue date Sep 26, 2017
- NXP USA, INC.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Scaled sigma sampling
- Patent number 8,806,418
- Issue date Aug 12, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Srinivas Jallepalli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Redistributed chip packaging with thermal contact to device backside
- Patent number 8,217,511
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifiers having improved protection against avalanche current
- Patent number 7,795,980
- Issue date Sep 14, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
- Publication number 20240291439
- Publication date Aug 29, 2024
- NXP USA, Inc.
- Geoffrey Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20240282654
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIAS CONTROL CIRCUIT FOR POWER TRANSISTORS
- Publication number 20230308052
- Publication date Sep 28, 2023
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIER BIAS CIRCUIT
- Publication number 20230299720
- Publication date Sep 21, 2023
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE-MOUNT AMPLIFIER DEVICES
- Publication number 20230133034
- Publication date May 4, 2023
- NXP USA, Inc.
- Lu LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTIPLE-STAGE DOHERTY POWER AMPLIFIERS IMPLEMENTED WITH MULTIPLE S...
- Publication number 20220416725
- Publication date Dec 29, 2022
- NXP USA, Inc.
- Mark Pieter van der Heijden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SENSING A CURRENT IN A CIRCUIT
- Publication number 20220131507
- Publication date Apr 28, 2022
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DOHERTY POWER AMPLIFIERS AND DEVICES WITH LOW VOLTAGE DRIVER STAGE...
- Publication number 20220123693
- Publication date Apr 21, 2022
- NXP USA, Inc.
- Lu WANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
- Publication number 20210328552
- Publication date Oct 21, 2021
- NXP USA, Inc.
- Geoffrey Tucker
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20210328551
- Publication date Oct 21, 2021
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WIDEBAND RF POWER SPLITTERS AND AMPLIFIERS INCLUDING WIDEBAND RF PO...
- Publication number 20210194434
- Publication date Jun 24, 2021
- NXP USA, Inc.
- Hussain Hasanali Ladhani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTIPLE-STAGE POWER AMPLIFIERS AND DEVICES WITH LOW-VOLTAGE DRIVER...
- Publication number 20210194443
- Publication date Jun 24, 2021
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DOHERTY AMPLIFIER WITH SURFACE-MOUNT PACKAGED CARRIER AND PEAKING A...
- Publication number 20210175186
- Publication date Jun 10, 2021
- NXP USA, Inc.
- Joseph Gerard Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CALIBRATING TEMPERATURE SENSORS
- Publication number 20210088389
- Publication date Mar 25, 2021
- NXP USA, Inc.
- Xu Jason MA
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR OPERATING A BIAS CONTROLLER FOR AN AMPLIFIE...
- Publication number 20210080992
- Publication date Mar 18, 2021
- NXP USA, Inc.
- Elie A. MAALOUF
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
COMPACT THREE-WAY DOHERTY AMPLIFIER MODULE
- Publication number 20210075374
- Publication date Mar 11, 2021
- NXP USA, Inc.
- Lu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AUTOMATICALLY BIASING POWER AMPLIFIERS USIN...
- Publication number 20200358404
- Publication date Nov 12, 2020
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIREC...
- Publication number 20200144968
- Publication date May 7, 2020
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SYSTEMS AND METHODS FOR AUTOMATICALLY BIASING POWER AMPLIFIERS
- Publication number 20200099345
- Publication date Mar 26, 2020
- NXP USA, Inc.
- Elie Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SYSTEMS AND METHODS FOR FAST SWITCHING TIME DIVISION DUPLEX OPERATI...
- Publication number 20200099344
- Publication date Mar 26, 2020
- NXP USA, Inc.
- Elie Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
- Publication number 20190098743
- Publication date Mar 28, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
- Publication number 20190021162
- Publication date Jan 17, 2019
- NXP USA, Inc.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIERS AND AMPLIFIER MODULES WITH SHUNT INDUCTANCE CIRCUITS THA...
- Publication number 20180175802
- Publication date Jun 21, 2018
- NXP USA, Inc.
- Yu-Ting David Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
- Publication number 20180153030
- Publication date May 31, 2018
- NXP USA, Inc.
- LAKSHMINARAYAN VISWANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIREC...
- Publication number 20180013391
- Publication date Jan 11, 2018
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20120252169
- Publication date Oct 4, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIERS HAVING IMPROVED PROTECTION AGAINST AVALANCHE CURRENT
- Publication number 20090309663
- Publication date Dec 17, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20090032933
- Publication date Feb 5, 2009
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS

Elie A. Maalouf

Person

Patents Grantslast 30 patents

Power amplifier modules including topside cooling interfaces and me...

Systems and methods for sensing a current in a circuit

Systems and methods for calibrating temperature sensors

Doherty power amplifiers and devices with low voltage driver stage...

Wideband RF power splitters and amplifiers including wideband RF po...

Systems and methods for operating a bias controller for an amplifie...

Doherty amplifier with surface-mount packaged carrier and peaking a...

Multiple-stage power amplifiers and devices with low-voltage driver...

Multiple-path RF amplifiers with angularly offset signal path direc...

Compact three-way Doherty amplifier module

Systems and methods for automatically biasing power amplifiers usin...

Amplifier die bond pad design and amplifier die arrangement for com...

Microelectronic modules with sinter-bonded heat dissipation structu...

Systems and methods for fast switching time division duplex operati...

Systems and methods for automatically biasing power amplifiers

Multiple-path RF amplifiers with angularly offset signal path direc...

Microelectronic modules with sinter-bonded heat dissipation structu...

Microelectronic modules including thermal extension levels and meth...

Amplifiers and amplifier modules with shunt inductance circuits tha...

Microelectronic modules with sinter-bonded heat dissipation structu...

Multiple-path RF amplifiers with angularly offset signal path direc...

Scaled sigma sampling

Redistributed chip packaging with thermal contact to device backside

Power amplifiers having improved protection against avalanche current

Patents Applicationslast 30 patents

POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...

BIAS CONTROL CIRCUIT FOR POWER TRANSISTORS

POWER AMPLIFIER BIAS CIRCUIT

SURFACE-MOUNT AMPLIFIER DEVICES

MULTIPLE-STAGE DOHERTY POWER AMPLIFIERS IMPLEMENTED WITH MULTIPLE S...

SYSTEMS AND METHODS FOR SENSING A CURRENT IN A CIRCUIT

DOHERTY POWER AMPLIFIERS AND DEVICES WITH LOW VOLTAGE DRIVER STAGE...

POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...

WIDEBAND RF POWER SPLITTERS AND AMPLIFIERS INCLUDING WIDEBAND RF PO...

MULTIPLE-STAGE POWER AMPLIFIERS AND DEVICES WITH LOW-VOLTAGE DRIVER...

DOHERTY AMPLIFIER WITH SURFACE-MOUNT PACKAGED CARRIER AND PEAKING A...

SYSTEMS AND METHODS FOR CALIBRATING TEMPERATURE SENSORS

SYSTEMS AND METHODS FOR OPERATING A BIAS CONTROLLER FOR AN AMPLIFIE...

COMPACT THREE-WAY DOHERTY AMPLIFIER MODULE

SYSTEMS AND METHODS FOR AUTOMATICALLY BIASING POWER AMPLIFIERS USIN...

MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIREC...

SYSTEMS AND METHODS FOR AUTOMATICALLY BIASING POWER AMPLIFIERS

SYSTEMS AND METHODS FOR FAST SWITCHING TIME DIVISION DUPLEX OPERATI...

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...

AMPLIFIERS AND AMPLIFIER MODULES WITH SHUNT INDUCTANCE CIRCUITS THA...

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...

MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIREC...

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE

POWER AMPLIFIERS HAVING IMPROVED PROTECTION AGAINST AVALANCHE CURRENT

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE