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Elie H. Najjar

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  • Norwood, MA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Compositions and methods for the electrodeposition of nanotwinned c...
    • Patent number 11,873,568
    • Issue date Jan 16, 2024
    • MacDermid Enthone Inc.
    • Kyle M. Whitten
    • B82 - NANO-TECHNOLOGY
  • Information Patent Grant

    Method and wet chemical compositions for diffusion barrier formation
    • Patent number 11,846,018
    • Issue date Dec 19, 2023
    • MacDermid Enthone Inc.
    • Richard W. Hurtubise
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Cobalt chemistry for smooth topology
    • Patent number 11,807,951
    • Issue date Nov 7, 2023
    • MacDermid Enthone Inc.
    • Shaopeng Sun
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cobalt filling of interconnects
    • Patent number 11,401,618
    • Issue date Aug 2, 2022
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Compositions and methods for the electrodeposition of nanotwinned c...
    • Patent number 11,384,446
    • Issue date Jul 12, 2022
    • MacDermid Enthone Inc.
    • Kyle M. Whitten
    • B82 - NANO-TECHNOLOGY
  • Information Patent Grant

    Cobalt chemistry for smooth topology
    • Patent number 11,230,778
    • Issue date Jan 25, 2022
    • MacDermid Enthone Inc.
    • Shaopeng Sun
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cobalt filling of interconnects
    • Patent number 11,035,048
    • Issue date Jun 15, 2021
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Filling through-holes
    • Patent number 10,154,598
    • Issue date Dec 11, 2018
    • Rohm and Haas Electronic Materials LLC
    • Nagarajan Jayaraju
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of filling through-holes
    • Patent number 9,598,787
    • Issue date Mar 21, 2017
    • Rohm and Haas Electronic Materials LLC
    • Nagarajan Jayaraju
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method of electroplating uniform copper layers
    • Patent number 9,365,943
    • Issue date Jun 14, 2016
    • Rohm and Haas Electronic Materials LLC
    • Elie H. Najjar
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Plating bath and method
    • Patent number 8,268,158
    • Issue date Sep 18, 2012
    • Rohm and Haas Electronic Materials LLC
    • Zukhra I. Niazimbetova
    • C07 - ORGANIC CHEMISTRY
  • Information Patent Grant

    Plating bath analysis
    • Patent number 6,827,839
    • Issue date Dec 7, 2004
    • Shipley Company, L.L.C.
    • Wade Sonnenberg
    • G01 - MEASURING TESTING

Patents Applicationslast 30 patents

  • Information Patent Application

    Compositions and Methods for the Electrodeposition of Nanotwinned C...
    • Publication number 20240110306
    • Publication date Apr 4, 2024
    • MacDermid Enthone Inc.
    • Kyle M. Whitten
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    Method and Wet Chemical Compositions for Diffusion Barrier Formation
    • Publication number 20230407467
    • Publication date Dec 21, 2023
    • MacDermid Enthone Inc.
    • Richard W. Hurtubise
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Compositions and Methods for the Electrodeposition of Nanotwinned C...
    • Publication number 20220298665
    • Publication date Sep 22, 2022
    • MacDermid Enthone Inc.
    • Kyle M. Whitten
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    Method and Wet Chemical Compositions for Diffusion Barrier Formation
    • Publication number 20220259724
    • Publication date Aug 18, 2022
    • MacDermid Enthone Inc.
    • Richard W. Hurtubise
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    COBALT CHEMISTRY FOR SMOOTH TOPOLOGY
    • Publication number 20220136123
    • Publication date May 5, 2022
    • MacDermid Enthone Inc.
    • Shaopeng Sun
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Composition and Method for Fabrication of Nickel Interconnects
    • Publication number 20220064811
    • Publication date Mar 3, 2022
    • MacDermid Enthone Inc.
    • Eric Yakobson
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Compositions and Methods for the Electrodeposition of Nanotwinned C...
    • Publication number 20220064812
    • Publication date Mar 3, 2022
    • MacDermid Enthone Inc.
    • Kyle M. Whitten
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    Cobalt Filling of Interconnects
    • Publication number 20210332491
    • Publication date Oct 28, 2021
    • MacDermid Enthone Inc.
    • John Commander
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    COBALT CHEMISTRY FOR SMOOTH TOPOLOGY
    • Publication number 20210180200
    • Publication date Jun 17, 2021
    • MacDermid Enthone Inc.
    • Shaopeng Sun
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PROCESS FOR METALIZATION OF COPPER PILLARS IN THE MANUFACTURE OF MI...
    • Publication number 20180355502
    • Publication date Dec 13, 2018
    • MacDermid Enthone Inc.
    • Elie Najjar
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    FILLING THROUGH-HOLES
    • Publication number 20160105975
    • Publication date Apr 14, 2016
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES
    • Publication number 20140262801
    • Publication date Sep 18, 2014
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES
    • Publication number 20140262799
    • Publication date Sep 18, 2014
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ELECTROPLATING UNIFORM COPPER LAYERS
    • Publication number 20120318676
    • Publication date Dec 20, 2012
    • Rohm and Haas Electronic Materials L.L.C.
    • Elie H. NAJJAR
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING BATH AND METHOD
    • Publication number 20110290660
    • Publication date Dec 1, 2011
    • Rohm and Haas Electronic Materials L.L.C.
    • Zukhra I. Niazimbetova
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method
    • Publication number 20110220512
    • Publication date Sep 15, 2011
    • Rohm and Haas Electronic Materials L.L.C.
    • Zukhra I. Niazimbetova
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath analysis
    • Publication number 20020074244
    • Publication date Jun 20, 2002
    • Shipley Company, L.L.C.
    • Wade Sonnenberg
    • G01 - MEASURING TESTING