Elizabeth Foster

Person

Friendsville, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuitized substrate with conductive polymer and seed material adh...
- Patent number 7,332,212
- Issue date Feb 19, 2008
- Endicott Interconnect Technologies, Inc.
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with filled blinds vias
- Patent number 7,084,509
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate and method of making same
- Patent number 7,063,762
- Issue date Jun 20, 2006
- Endicott Interconnect Technologies, Inc.
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming filled blind vias
- Patent number 6,924,224
- Issue date Aug 2, 2005
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accelerated etching of chromium
- Patent number 6,843,929
- Issue date Jan 18, 2005
- International Business Machines Corporation
- Donald S. Farquhar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photoimageable dielectric epoxy resin system film
- Patent number 6,835,533
- Issue date Dec 28, 2004
- International Business Machines Corporation
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a multi-layered interconnect structure
- Patent number 6,829,823
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Francis J. Downes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating circuitized structures
- Patent number 6,706,464
- Issue date Mar 16, 2004
- International Business Machines Corporation
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metallic z-interconnects for laminate chip packag...
- Patent number 6,634,543
- Issue date Oct 21, 2003
- International Business Machines Corporation
- Brian E. Curcio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,576,549
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating circuitized structures
- Patent number 6,528,218
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,522,014
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with high density interconnect layer
- Patent number 6,373,717
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning a layered chrome-copper structure disposed on a dielectr...
- Patent number 6,335,495
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for pattern seeding and plating of high density printed circ...
- Patent number 6,207,351
- Issue date Mar 27, 2001
- International Business Machines Corporation
- Douglas Adam Cywar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gray scale etching for thin flexible interposer
- Patent number 6,156,484
- Issue date Dec 5, 2000
- International Business Machines Corporation
- Ernest Bassous
- G01 - MEASURING TESTING
Information Patent Grant
Structure including a partially electrochemically reduced halogenat...
- Patent number 5,874,154
- Issue date Feb 23, 1999
- International Business Machines Corporation
- Harry Randall Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fluid jet impregnating and coating device with thickness control ca...
- Patent number 5,863,332
- Issue date Jan 26, 1999
- International Business Machines Corporation
- Elizabeth Foster
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fluid jet impregnation
- Patent number 5,824,157
- Issue date Oct 20, 1998
- International Business Machines Corporation
- Elizabeth F. Foster
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for conditioning halogenated polymeric materials and structu...
- Patent number 5,800,858
- Issue date Sep 1, 1998
- International Business Machines Corporation
- Harry Randall Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for conditioning halogenated polymeric materials and structu...
- Patent number 5,730,890
- Issue date Mar 24, 1998
- Internationl Business Machines Corporation
- Harry Randall Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Expandable fluid treatment device for tublar surface treatments
- Patent number 5,725,668
- Issue date Mar 10, 1998
- International Business Machines Corporation
- Elizabeth F. Foster
- B08 - CLEANING
Information Patent Grant
Method for conditioning halogenated polymeric materials and structu...
- Patent number 5,709,906
- Issue date Jan 20, 1998
- International Business Machines Corporation
- Harry Randall Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fluorinated carbon polymer composites
- Patent number 5,591,285
- Issue date Jan 7, 1997
- International Business Machines Corp.
- Ali Afzali-Ardakani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluorinated carbon polymer composites
- Patent number 5,571,852
- Issue date Nov 5, 1996
- International Business Machines Corporation
- Ali Afzali-Ardakani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluorinated carbon polymer composites
- Patent number 5,556,899
- Issue date Sep 17, 1996
- International Business Machines Corporation
- Ali Afzali-Ardakani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluorinated carbon polymer composites
- Patent number 5,397,863
- Issue date Mar 14, 1995
- International Business Machines Corporation
- Ali Afzali-Ardakani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for conditioning halogenated polymeric materials and structu...
- Patent number 5,374,454
- Issue date Dec 20, 1994
- International Business Machines Incorporated
- Harry R. Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of external circuitization of a circuit panel
- Patent number 5,158,645
- Issue date Oct 27, 1992
- International Business Machines, Inc.
- Kathleen L. Covert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuitized substrate and method of making same
- Publication number 20060029781
- Publication date Feb 9, 2006
- Endicott Interconnect Technologies, Inc.
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate and method of making same
- Publication number 20050039840
- Publication date Feb 24, 2005
- Endicott Interconnect Technologies, Inc.
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photoimageable dielectric epoxy resin system film
- Publication number 20040161702
- Publication date Aug 19, 2004
- International Business Machines Corporation
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package with filled blind vias
- Publication number 20040132279
- Publication date Jul 8, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package with filled blinds vias
- Publication number 20040065960
- Publication date Apr 8, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming metallic z-interconnects for laminate chip packag...
- Publication number 20030127495
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Brian E. Curcio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating circuitized structures
- Publication number 20030129536
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Elizabeth Foster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication of a metalized blind via
- Publication number 20030054635
- Publication date Mar 20, 2003
- Frank D. Egitto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package with high density interconnect layer
- Publication number 20020085364
- Publication date Jul 4, 2002
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS

Elizabeth Foster

Person

Patents Grantslast 30 patents

Circuitized substrate with conductive polymer and seed material adh...

Electronic package with filled blinds vias

Circuitized substrate and method of making same

Method of forming filled blind vias

Accelerated etching of chromium

Photoimageable dielectric epoxy resin system film

Method of making a multi-layered interconnect structure

Method of fabricating circuitized structures

Method of forming metallic z-interconnects for laminate chip packag...

Fabrication of a metalized blind via

Method of fabricating circuitized structures

Fabrication of a metalized blind via

Electronic package with high density interconnect layer

Patterning a layered chrome-copper structure disposed on a dielectr...

Method for pattern seeding and plating of high density printed circ...

Gray scale etching for thin flexible interposer

Structure including a partially electrochemically reduced halogenat...

Fluid jet impregnating and coating device with thickness control ca...

Fluid jet impregnation

Method for conditioning halogenated polymeric materials and structu...

Method for conditioning halogenated polymeric materials and structu...

Expandable fluid treatment device for tublar surface treatments

Method for conditioning halogenated polymeric materials and structu...

Fluorinated carbon polymer composites

Fluorinated carbon polymer composites

Fluorinated carbon polymer composites

Fluorinated carbon polymer composites

Method for conditioning halogenated polymeric materials and structu...

Method of external circuitization of a circuit panel

Patents Applicationslast 30 patents

Circuitized substrate and method of making same

Circuitized substrate and method of making same

Photoimageable dielectric epoxy resin system film

Electronic package with filled blind vias

Electronic package with filled blinds vias

Method of forming metallic z-interconnects for laminate chip packag...

Method of fabricating circuitized structures

Fabrication of a metalized blind via

Electronic package with high density interconnect layer