Ella Chan Sarmiento

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Baguio City, PH

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer sawing system and method
- Patent number 7,943,425
- Issue date May 17, 2011
- Texas Instruments Incorporated
- Patricio Vergara Ancheta
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for sawing semiconductor wafer
- Patent number 7,521,338
- Issue date Apr 21, 2009
- Texas Instruments Incorporated
- Patricio Vergara Ancheta, Jr.
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Wafer Sawing System and Method
- Publication number 20090263954
- Publication date Oct 22, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Patricio Vergara Ancheta
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Semiconductor Wafer Sawing System and Method
- Publication number 20080153260
- Publication date Jun 26, 2008
- Patricio Vergara Ancheta
- B28 - WORKING CEMENT, CLAY, OR STONE