Elley Zhang

Follow

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method of thinning a semiconductor die
- Patent number 12,341,130
- Issue date Jun 24, 2025
- Western Digital Technologies, Inc.
- Meiqin Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with exposed bond wires
- Patent number 11,942,459
- Issue date Mar 26, 2024
- Western Digital Technologies, Inc.
- Hua Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Thinning a Semiconductor Die
- Publication number 20230326906
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Meiqin Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Exposed Bond Wires
- Publication number 20230260975
- Publication date Aug 17, 2023
- Western Digital Technologies, Inc.
- Hua Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Having Improved Conductive Stub Coverage
- Publication number 20230129628
- Publication date Apr 27, 2023
- Western Digital Technologies, Inc.
- Simon Dong
- H01 - BASIC ELECTRIC ELEMENTS