Elliott Simons

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Southborough, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
3D chip package with shielded structures
- Patent number 8,686,543
- Issue date Apr 1, 2014
- Maxim Integrated Products, Inc.
- Albert Bergemont
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D CHIP PACKAGE WITH SHIELDED STRUCTURES
- Publication number 20130105950
- Publication date May 2, 2013
- MAXIM INTEGRATED PRODUCTS, INC.
- Albert Bergemont
- H01 - BASIC ELECTRIC ELEMENTS