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Ellis Lee
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Taipei, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Method making bonding pad
Patent number
6,987,057
Issue date
Jan 17, 2006
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure with an enlarged air gaps disposed between c...
Patent number
6,940,146
Issue date
Sep 6, 2005
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure with an enlarged air gaps disposed between c...
Patent number
6,914,318
Issue date
Jul 5, 2005
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure with an enlarged air gaps disposed between c...
Patent number
6,888,247
Issue date
May 3, 2005
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad structure
Patent number
6,794,752
Issue date
Sep 21, 2004
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming an interconnect structure with air gap compatibl...
Patent number
6,492,256
Issue date
Dec 10, 2002
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure with air gap compatible with unlanded vias
Patent number
6,492,732
Issue date
Dec 10, 2002
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating shallow trench isolation
Patent number
6,245,635
Issue date
Jun 12, 2001
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating copper interconnection
Patent number
6,171,960
Issue date
Jan 9, 2001
United Microelectronics Corp.
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Interconnect structure
Publication number
20040056358
Publication date
Mar 25, 2004
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect structure with an enlarged air gaps disposed between c...
Publication number
20040056359
Publication date
Mar 25, 2004
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding pad structure and method for making same
Publication number
20030006505
Publication date
Jan 9, 2003
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING AN INTERCONNECT STRUCTURE WITH AIR GAP COMPATIBL...
Publication number
20020163082
Publication date
Nov 7, 2002
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect structure
Publication number
20020014679
Publication date
Feb 7, 2002
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding pad structure and method for making same
Publication number
20010022403
Publication date
Sep 20, 2001
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect structure with air gap compatible with unlanded vias
Publication number
20010016412
Publication date
Aug 23, 2001
Ellis Lee
H01 - BASIC ELECTRIC ELEMENTS