Elmar Wisotzki

Person

Darmstadt, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast recovery inverse diode
- Patent number 10,714,635
- Issue date Jul 14, 2020
- Littlfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast recovery inverse diode
- Patent number 10,193,000
- Issue date Jan 29, 2019
- IXYS, LLC
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast recovery inverse diode
- Patent number 10,164,124
- Issue date Dec 25, 2018
- IXYS, LLC
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverse diode stack
- Patent number 9,941,256
- Issue date Apr 10, 2018
- IXYS Corporation
- Frank Ettingshausen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Trench separation diffusion for high voltage device
- Patent number 9,922,864
- Issue date Mar 20, 2018
- IXYS Corporation
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 9,704,832
- Issue date Jul 11, 2017
- IXYS Corporation
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench separation diffusion for high voltage device
- Patent number 9,590,033
- Issue date Mar 7, 2017
- IXYS Corporation
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device manufacture on the recessed side of a thinned wafer
- Patent number 8,716,067
- Issue date May 6, 2014
- IXYS Corporation
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAST RECOVERY INVERSE DIODE
- Publication number 20200287058
- Publication date Sep 10, 2020
- IXYS, LLC
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAST RECOVERY INVERSE DIODE
- Publication number 20190115480
- Publication date Apr 18, 2019
- IXYS, LLC
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20170278828
- Publication date Sep 28, 2017
- IXYS Corporation
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Separation Diffusion for High Voltage Device
- Publication number 20170178947
- Publication date Jun 22, 2017
- IXYS Corporation
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE MANUFACTURE ON THE RECESSED SIDE OF A THINNED WAFER
- Publication number 20130217185
- Publication date Aug 22, 2013
- IXYS Corporation
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS

Elmar Wisotzki

Person

Patents Grantslast 30 patents

Die stack assembly using an edge separation structure for connectiv...

Die stack assembly using an edge separation structure for connectiv...

Fast recovery inverse diode

Fast recovery inverse diode

Fast recovery inverse diode

Inverse diode stack

Trench separation diffusion for high voltage device

Die stack assembly using an edge separation structure for connectiv...

Trench separation diffusion for high voltage device

Power device manufacture on the recessed side of a thinned wafer

Patents Applicationslast 30 patents

FAST RECOVERY INVERSE DIODE

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

FAST RECOVERY INVERSE DIODE

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

Trench Separation Diffusion for High Voltage Device

POWER DEVICE MANUFACTURE ON THE RECESSED SIDE OF A THINNED WAFER