Elsie Agdon Cabahug

Person

Mandaue, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package with clip interconnect and dual side c...
- Patent number 12,051,635
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concealed gate terminal semiconductor packages and related methods
- Patent number 11,791,247
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta Almagro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC MOSFET semiconductor packages and related methods
- Patent number 11,621,203
- Issue date Apr 4, 2023
- Semiconductor Components Industries, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heatsink
- Patent number 11,616,006
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interposer on a leaderframe
- Patent number 11,296,069
- Issue date Apr 5, 2022
- Semiconductor Components Industries, LLC
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with clip interconnect and dual side c...
- Patent number 11,088,046
- Issue date Aug 10, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interposer on a leadframe
- Patent number 10,546,847
- Issue date Jan 28, 2020
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package using leadframe and clip and method of ma...
- Patent number 8,058,107
- Issue date Nov 15, 2011
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust leaded molded packages and methods for forming the same
- Patent number 7,906,837
- Issue date Mar 15, 2011
- Fairchild Semiconductor Corporation
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust leaded molded packages and methods for forming the same
- Patent number 7,560,311
- Issue date Jul 14, 2009
- Fairchild Semiconductor Corporation
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package using leadframe and clip and method of ma...
- Patent number 7,285,849
- Issue date Oct 23, 2007
- Fairchild Semiconductor Corporation
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust leaded molded packages and methods for forming the same
- Patent number 7,122,884
- Issue date Oct 17, 2006
- Fairchild Semiconductor Corporation
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Column ball grid array package
- Patent number 6,391,687
- Issue date May 21, 2002
- Fairchild Semiconductor Corporation
- Elsie A. Cabahug
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
- Publication number 20240363471
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230402350
- Publication date Dec 14, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta ALMAGRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230207411
- Publication date Jun 29, 2023
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20220102248
- Publication date Mar 31, 2022
- Semiconductor Components Industries, LLC
- Erwin Ian Vamenta ALMAGRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
- Publication number 20210351099
- Publication date Nov 11, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEATSINK
- Publication number 20200273782
- Publication date Aug 27, 2020
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTERPOSER ON A LEADFRAME
- Publication number 20200219866
- Publication date Jul 9, 2020
- Fairchild Semiconductor Corporation
- Elsie Agdon CABAHUG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20200098870
- Publication date Mar 26, 2020
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
- Publication number 20190393119
- Publication date Dec 26, 2019
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTERPOSER ON A LEADFRAME
- Publication number 20160284631
- Publication date Sep 29, 2016
- Fairchild Semiconductor Corporation
- Elsie Agdon CABAHUG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST LEADED MOLDED PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20090236714
- Publication date Sep 24, 2009
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MA...
- Publication number 20080044946
- Publication date Feb 21, 2008
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package using leadframe and clip and method of ma...
- Publication number 20070114352
- Publication date May 24, 2007
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust leaded molded packages and methods for forming the same
- Publication number 20060231933
- Publication date Oct 19, 2006
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust leaded molded packages and methods for forming the same
- Publication number 20030193080
- Publication date Oct 16, 2003
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS

Elsie Agdon Cabahug

Person

Patents Grantslast 30 patents

Semiconductor device package with clip interconnect and dual side c...

Concealed gate terminal semiconductor packages and related methods

SiC MOSFET semiconductor packages and related methods

Semiconductor package with heatsink

Substrate interposer on a leaderframe

Semiconductor device package with clip interconnect and dual side c...

Substrate interposer on a leadframe

Semiconductor die package using leadframe and clip and method of ma...

Robust leaded molded packages and methods for forming the same

Robust leaded molded packages and methods for forming the same

Semiconductor die package using leadframe and clip and method of ma...

Robust leaded molded packages and methods for forming the same

Column ball grid array package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...

CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS

CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...

SEMICONDUCTOR PACKAGE WITH HEATSINK

SUBSTRATE INTERPOSER ON A LEADFRAME

SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...

SUBSTRATE INTERPOSER ON A LEADFRAME

ROBUST LEADED MOLDED PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MA...

Semiconductor die package using leadframe and clip and method of ma...

Robust leaded molded packages and methods for forming the same

Robust leaded molded packages and methods for forming the same