Elstan Anthony Fernandez

Person

Aljunied Crescent, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for connecting a die assembly to a substrate in an integrate...
- Patent number 8,263,438
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Alvin Seah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for connecting a die assembly to a substrate in an integrate...
- Patent number 7,880,277
- Issue date Feb 1, 2011
- Infineon Technologies AG
- Alvin Seah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package employing a flexible substrate
- Patent number 7,659,620
- Issue date Feb 9, 2010
- Infineon Technologies, AG
- Elstan Anthony Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package employing a heat-spreader member
- Patent number 7,224,058
- Issue date May 29, 2007
- Infineon Technologies AG
- Elstan Anthony Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pads for heat spreader attach
- Patent number 6,278,613
- Issue date Aug 21, 2001
- ST Assembly Test Services PTE LTD
- Elstan Anthony Fernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Connecting a Die Assembly to a Substrate in an Integrate...
- Publication number 20110097848
- Publication date Apr 28, 2011
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component With Stacked Semiconductor Chips And Heat Diss...
- Publication number 20070205495
- Publication date Sep 6, 2007
- Elstan Anthony Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for connecting a die assembly to a substrate in an integrate...
- Publication number 20070040251
- Publication date Feb 22, 2007
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package employing a heat-spreader member
- Publication number 20060081980
- Publication date Apr 20, 2006
- Infineon Technologies AG
- Elstan Anthony Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package employing a flexible substrate
- Publication number 20060076655
- Publication date Apr 13, 2006
- Elstan Anthony Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging integrated circuits, and integrated circuit pac...
- Publication number 20060012035
- Publication date Jan 19, 2006
- Infineon Technologies AG
- Elstan Anthony Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipation device for integrated circuits
- Publication number 20060012031
- Publication date Jan 19, 2006
- Elstan Anthony Fernandez
- H01 - BASIC ELECTRIC ELEMENTS

Elstan Anthony Fernandez

Person

Patents Grantslast 30 patents

Method for connecting a die assembly to a substrate in an integrate...

Method for connecting a die assembly to a substrate in an integrate...

Integrated circuit package employing a flexible substrate

Integrated circuit package employing a heat-spreader member

Copper pads for heat spreader attach

Patents Applicationslast 30 patents

Method for Connecting a Die Assembly to a Substrate in an Integrate...

Electronic Component With Stacked Semiconductor Chips And Heat Diss...

Method for connecting a die assembly to a substrate in an integrate...

Integrated circuit package employing a heat-spreader member

Integrated circuit package employing a flexible substrate

Method of packaging integrated circuits, and integrated circuit pac...

Heat dissipation device for integrated circuits