Elvir Kahrimanovic

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Multiphase inverter apparatus having half-bridge circuits and a pha...
- Patent number 11,979,096
- Issue date May 7, 2024
- Infineon Technologies Austria AG
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistor packages with exposed source and drain cont...
- Patent number 11,600,558
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiphase inverter apparatus
- Patent number 11,303,222
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit arrangement, redistribution board, module and method of fab...
- Patent number 11,139,297
- Issue date Oct 5, 2021
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with insulated metal substrate made of steel
- Patent number 10,426,028
- Issue date Sep 24, 2019
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a printed circuit board and a metal workpiece
- Patent number 10,117,321
- Issue date Oct 30, 2018
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...
- Publication number 20230187326
- Publication date Jun 15, 2023
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20220254703
- Publication date Aug 11, 2022
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPHASE INVERTER APPARATUS HAVING HALF-BRIDGE CIRCUITS AND A PHA...
- Publication number 20220224247
- Publication date Jul 14, 2022
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Multiphase Inverter Apparatus
- Publication number 20210104957
- Publication date Apr 8, 2021
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Chip Package, Method of Forming a Chip Package, Semiconductor Devic...
- Publication number 20200328141
- Publication date Oct 15, 2020
- INFINEON TECHNOLOGIES AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Arrangement, Redistribution Board, Module and Method of Fab...
- Publication number 20190296014
- Publication date Sep 26, 2019
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board with Insulated Metal Substrate Made of Steel
- Publication number 20180352653
- Publication date Dec 6, 2018
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A PRINTED CIRCUIT BOARD AND A METAL WORKPIECE
- Publication number 20160165715
- Publication date Jun 9, 2016
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Elvir Kahrimanovic

Person

Patents Grantslast 30 patents

Multiphase inverter apparatus having half-bridge circuits and a pha...

Semiconductor device

Semiconductor device having a carrier, semiconductor chip packages...

Plurality of transistor packages with exposed source and drain cont...

Multiphase inverter apparatus

Circuit arrangement, redistribution board, module and method of fab...

Printed circuit board with insulated metal substrate made of steel

Device including a printed circuit board and a metal workpiece

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...

Semiconductor Device

MULTIPHASE INVERTER APPARATUS HAVING HALF-BRIDGE CIRCUITS AND A PHA...

Multiphase Inverter Apparatus

Chip Package, Method of Forming a Chip Package, Semiconductor Devic...

Circuit Arrangement, Redistribution Board, Module and Method of Fab...

Printed Circuit Board with Insulated Metal Substrate Made of Steel

DEVICE INCLUDING A PRINTED CIRCUIT BOARD AND A METAL WORKPIECE