Emerson Mamaril Enipin

Follow

Person

Angeles City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
MCM package isolation through leadframe design and package saw process
- Patent number 11,862,479
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MCM package isolation through leadframe design and package saw process
- Patent number 11,081,366
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making a stacked semiconductor package having a clip
- Patent number 8,883,567
- Issue date Nov 11, 2014
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MCM Package Isolation Through Leadframe Design and Package Saw Process
- Publication number 20210320014
- Publication date Oct 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM PACKAGE ISOLATION THROUGH LEADFRAME DESIGN AND PACKAGE SAW PROCESS
- Publication number 20200185234
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Package
- Publication number 20130256852
- Publication date Oct 3, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS