Emi Miyazawa

Person

Tsukuba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 12,084,599
- Issue date Sep 10, 2024
- Resonac Corporation
- Emi Miyazawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 11,840,648
- Issue date Dec 12, 2023
- Resonac Corporation
- Emi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition for sealing packing of semiconducto...
- Patent number 9,431,314
- Issue date Aug 30, 2016
- Hitachi Chemical Company, Ltd.
- Tetsuya Enomoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...
- Publication number 20240093059
- Publication date Mar 21, 2024
- Resonac Corporation
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...
- Publication number 20230369093
- Publication date Nov 16, 2023
- Resonac Corporation
- Yasuyuki OYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION...
- Publication number 20230360947
- Publication date Nov 9, 2023
- Yasuyuki OYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY FIXATION LAYERED FILM AND PRODUCTION METHOD THEREFOR, TEM...
- Publication number 20230207374
- Publication date Jun 29, 2023
- Showa Denko Materials Co., Ltd.
- Yuta AKASU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20220319872
- Publication date Oct 6, 2022
- Showa Denko Materials Co., Ltd.
- Yuta AKASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPOR...
- Publication number 20220028722
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...
- Publication number 20200399506
- Publication date Dec 24, 2020
- HITACHI CHEMICAL COMPANY, LTD.
- Emi MIYAZAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEPARATION MATERIAL
- Publication number 20200047084
- Publication date Feb 13, 2020
- Hitachi Chemical Company, Ltd.
- Akiko KAWAGUCHI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEPARATION MATERIAL, COLUMN PROVIDED WITH SAID SEPARATION MATERIAL,...
- Publication number 20190176126
- Publication date Jun 13, 2019
- Hitachi Chemical Company, Ltd.
- Masaru WATANABE
- G01 - MEASURING TESTING
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTO...
- Publication number 20120101191
- Publication date Apr 26, 2012
- Hitachi Chemical Company, Ltd.
- Tetsuya ENOMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMIC...
- Publication number 20110241228
- Publication date Oct 6, 2011
- Hitachi Chemical Company, Ltd.
- Tetsuya ENOMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Emi Miyazawa

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method, curable resin compositio...

Semiconductor device manufacturing method, curable resin compositio...

Thermosetting resin composition for sealing packing of semiconducto...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...

FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION...

TEMPORARY FIXATION LAYERED FILM AND PRODUCTION METHOD THEREFOR, TEM...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPOR...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...

SEPARATION MATERIAL

SEPARATION MATERIAL, COLUMN PROVIDED WITH SAID SEPARATION MATERIAL,...

THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTO...

EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMIC...