Emiko Tani

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Suspension board and load beam combination including a positioning...
- Patent number 10,028,370
- Issue date Jul 17, 2018
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE
Information Patent Grant
Coil printed circuit board, power reception module, battery unit an...
- Patent number 9,843,216
- Issue date Dec 12, 2017
- Nitto Denko Corporation
- Tadao Ookawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Suspension board with circuit, producing method thereof, and positi...
- Patent number 9,072,207
- Issue date Jun 30, 2015
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE
Information Patent Grant
Optical sensor module
- Patent number 8,452,138
- Issue date May 28, 2013
- Nitto Denko Corporation
- Ryusuke Naito
- G02 - OPTICS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 7,646,611
- Issue date Jan 12, 2010
- Nitto Denko Corporation
- Emiko Tani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Groove formed around a semiconductor device on a circuit board
- Patent number D585394
- Issue date Jan 27, 2009
- Nitto Denko Corporation
- Tetsuya Ohsawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Grooves formed around a semiconductor device on a circuit board
- Patent number D584250
- Issue date Jan 6, 2009
- Nitto Denko Corporation
- Emiko Tani
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Grooves formed around a semiconductor device on a circuit board
- Patent number D584249
- Issue date Jan 6, 2009
- Nitto Denko Corporation
- Emiko Tani
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Grooves formed around a semiconductor device on a circuit board
- Patent number D577691
- Issue date Sep 30, 2008
- Nitto Denko Corporation
- Tetsuya Ohsawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Grooves formed around a semiconductor device on a circuit board
- Patent number D577692
- Issue date Sep 30, 2008
- Nitto Denko Corporation
- Tetsuya Ohsawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Groove formed around a semiconductor device on a circuit board
- Patent number D568836
- Issue date May 13, 2008
- Nitto Denko Corporation
- Tetsuya Ohsawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Groove formed around a semiconductor device on a circuit board
- Patent number D567774
- Issue date Apr 29, 2008
- Nitto Denko Corporation
- Emiko Tani
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Grooves formed around a semiconductor device on a circuit board
- Patent number D566060
- Issue date Apr 8, 2008
- Nitto Denko Corporation
- Tetsuya Ohsawa
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
COIL PRINTED CIRCUIT BOARD, POWER RECEPTION MODULE, BATTERY UNIT AN...
- Publication number 20160094082
- Publication date Mar 31, 2016
- Nitto Denko Corporation
- Tadao OOKAWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT, PRODUCING METHOD THEREOF, AND POSITI...
- Publication number 20150264795
- Publication date Sep 17, 2015
- Nitto Denko Corporation
- Yasunari OOYABU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERLAY-BOARD-EQUIPPED INPUT DEVICE
- Publication number 20130009911
- Publication date Jan 10, 2013
- Nitto Denko Corporation
- Naoki Shibata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL SENSOR MODULE
- Publication number 20120201490
- Publication date Aug 9, 2012
- Nitto Denko Corporation
- Ryusuke Naito
- G02 - OPTICS
Information Patent Application
Suspension board with circuit, producing method thereof, and positi...
- Publication number 20100032201
- Publication date Feb 11, 2010
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080180928
- Publication date Jul 31, 2008
- Nitto Denko Corporation
- Emiko TANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Suspension board and load beam combination including a positioning...

Coil printed circuit board, power reception module, battery unit an...

Suspension board with circuit, producing method thereof, and positi...

Optical sensor module

Printed circuit board and manufacturing method thereof

Groove formed around a semiconductor device on a circuit board

Grooves formed around a semiconductor device on a circuit board

Grooves formed around a semiconductor device on a circuit board

Grooves formed around a semiconductor device on a circuit board

Grooves formed around a semiconductor device on a circuit board

Groove formed around a semiconductor device on a circuit board

Groove formed around a semiconductor device on a circuit board

Grooves formed around a semiconductor device on a circuit board

Patents Applicationslast 30 patents

COIL PRINTED CIRCUIT BOARD, POWER RECEPTION MODULE, BATTERY UNIT AN...

SUSPENSION BOARD WITH CIRCUIT, PRODUCING METHOD THEREOF, AND POSITI...

UNDERLAY-BOARD-EQUIPPED INPUT DEVICE

OPTICAL SENSOR MODULE

Suspension board with circuit, producing method thereof, and positi...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF