Emile Davies-Venn

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stiffener and package substrate for a semiconductor package
- Patent number 11,295,998
- Issue date Apr 5, 2022
- Intel Corporation
- Stephen Christianson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive coating for a microelectronics package
- Patent number 10,910,314
- Issue date Feb 2, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive coating for a microelectronics package
- Patent number 10,510,667
- Issue date Dec 17, 2019
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer (BBUL) semiconductor package with ultra-thi...
- Patent number 9,520,350
- Issue date Dec 13, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-based filtering and matching solutions
- Patent number 8,804,366
- Issue date Aug 12, 2014
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-based filtering and matching solutions
- Patent number 8,111,521
- Issue date Feb 7, 2012
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package embedded three dimensional balun
- Patent number 7,626,472
- Issue date Dec 1, 2009
- Intel Corporation
- Emile Davies-Venn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE
- Publication number 20200118930
- Publication date Apr 16, 2020
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE
- Publication number 20190311963
- Publication date Oct 10, 2019
- Intel Corporation
- Stephen CHRISTIANSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE
- Publication number 20180174972
- Publication date Jun 21, 2018
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER (BBUL) SEMICONDUCTOR PACKAGE WITH ULTRA-THI...
- Publication number 20140264830
- Publication date Sep 18, 2014
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-BASED FILTERING AND MATCHING SOLUTIONS
- Publication number 20120092076
- Publication date Apr 19, 2012
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-BASED FILTERING AND MATCHING SOLUTIONS
- Publication number 20090039986
- Publication date Feb 12, 2009
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package embedded three dimensional balun
- Publication number 20080238568
- Publication date Oct 2, 2008
- Emile Davies-venn
- H03 - BASIC ELECTRONIC CIRCUITRY

Emile Davies-Venn

Person

Patents Grantslast 30 patents

Stiffener and package substrate for a semiconductor package

Conductive coating for a microelectronics package

Conductive coating for a microelectronics package

Bumpless build-up layer (BBUL) semiconductor package with ultra-thi...

Package-based filtering and matching solutions

Package-based filtering and matching solutions

Package embedded three dimensional balun

Patents Applicationslast 30 patents

CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE

STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE

CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE

BUMPLESS BUILD-UP LAYER (BBUL) SEMICONDUCTOR PACKAGE WITH ULTRA-THI...

PACKAGE-BASED FILTERING AND MATCHING SOLUTIONS

PACKAGE-BASED FILTERING AND MATCHING SOLUTIONS

Package embedded three dimensional balun