Emre Topal

Follow

Person

Munchen, DE

People

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE
- Publication number 20250197196
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Emre TOPAL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE PACKAGE WITH GUARD STRUCTURE TO REDUCE OR PREVENT MATERIAL SEEP...
- Publication number 20250096164
- Publication date Mar 20, 2025
- QUALCOMM TECHNOLOGIES, INC.
- Yeng Kwan Hoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS
- Publication number 20240203938
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Yeng Kwan Hoo
- H01 - BASIC ELECTRIC ELEMENTS