Enboa Wu

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for self-assembling microstructures
- Patent number 7,943,052
- Issue date May 17, 2011
- NATIONAL TAIWAN UNIVERSITY
- Enboa Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal enhanced low profile package structure and method for fabri...
- Patent number 7,754,530
- Issue date Jul 13, 2010
- Industrial Technology Research Institute
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced low profile package structure
- Patent number 7,511,365
- Issue date Mar 31, 2009
- Industrial Technology Research Institute
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer level package of sensor chip
- Patent number 7,351,609
- Issue date Apr 1, 2008
- NATIONAL TAIWAN UNIVERSITY
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode covered with a reflective layer and method for...
- Patent number 7,271,020
- Issue date Sep 18, 2007
- NATIONAL TAIWAN UNIVERSITY
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having an aperture position through a substrat...
- Patent number 6,459,150
- Issue date Oct 1, 2002
- Industrial Technology Research Institute
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package incorporating dual stress buffer layers for I/O...
- Patent number 6,433,427
- Issue date Aug 13, 2002
- Industrial Technology Research Institute
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL ENHANCED LOW PROFILE PACKAGE STRUCTURE AND METHOD FOR FABRI...
- Publication number 20090155954
- Publication date Jun 18, 2009
- Industrial Technology Research Institute
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELF-ASSEMBLING MICROSTRUCTURES
- Publication number 20080023435
- Publication date Jan 31, 2008
- Enboa WU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for wafer level package of sensor chip
- Publication number 20070224728
- Publication date Sep 27, 2007
- National Taiwan University
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for self-assembling microstructures
- Publication number 20070007237
- Publication date Jan 11, 2007
- National Taiwan University
- Enboa Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal enhanced low profile package structure and method for fabri...
- Publication number 20060237827
- Publication date Oct 26, 2006
- Industrial Technology Research Institute
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of electronic package and method for fabricating the same
- Publication number 20060108146
- Publication date May 25, 2006
- Industrial Technology Research Institute
- Enboa Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emitting diode covered with a reflective layer and method for...
- Publication number 20060086943
- Publication date Apr 27, 2006
- National Taiwan University
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE INCORPORATING DUAL STRESS BUFFER LAYERS FOR I/O...
- Publication number 20020093107
- Publication date Jul 18, 2002
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for self-assembling microstructures

Thermal enhanced low profile package structure and method for fabri...

Thermal enhanced low profile package structure

Method for wafer level package of sensor chip

Light emitting diode covered with a reflective layer and method for...

Electronic substrate having an aperture position through a substrat...

Wafer level package incorporating dual stress buffer layers for I/O...

Patents Applicationslast 30 patents

THERMAL ENHANCED LOW PROFILE PACKAGE STRUCTURE AND METHOD FOR FABRI...

METHOD FOR SELF-ASSEMBLING MICROSTRUCTURES

Method for wafer level package of sensor chip

Method for self-assembling microstructures

Thermal enhanced low profile package structure and method for fabri...

Structure of electronic package and method for fabricating the same

Light emitting diode covered with a reflective layer and method for...

WAFER LEVEL PACKAGE INCORPORATING DUAL STRESS BUFFER LAYERS FOR I/O...