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Enboa Wu
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Taipei City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Method for self-assembling microstructures
Patent number
7,943,052
Issue date
May 17, 2011
NATIONAL TAIWAN UNIVERSITY
Enboa Wu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermal enhanced low profile package structure and method for fabri...
Patent number
7,754,530
Issue date
Jul 13, 2010
Industrial Technology Research Institute
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal enhanced low profile package structure
Patent number
7,511,365
Issue date
Mar 31, 2009
Industrial Technology Research Institute
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for wafer level package of sensor chip
Patent number
7,351,609
Issue date
Apr 1, 2008
NATIONAL TAIWAN UNIVERSITY
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode covered with a reflective layer and method for...
Patent number
7,271,020
Issue date
Sep 18, 2007
NATIONAL TAIWAN UNIVERSITY
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic substrate having an aperture position through a substrat...
Patent number
6,459,150
Issue date
Oct 1, 2002
Industrial Technology Research Institute
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package incorporating dual stress buffer layers for I/O...
Patent number
6,433,427
Issue date
Aug 13, 2002
Industrial Technology Research Institute
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THERMAL ENHANCED LOW PROFILE PACKAGE STRUCTURE AND METHOD FOR FABRI...
Publication number
20090155954
Publication date
Jun 18, 2009
Industrial Technology Research Institute
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SELF-ASSEMBLING MICROSTRUCTURES
Publication number
20080023435
Publication date
Jan 31, 2008
Enboa WU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for wafer level package of sensor chip
Publication number
20070224728
Publication date
Sep 27, 2007
National Taiwan University
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for self-assembling microstructures
Publication number
20070007237
Publication date
Jan 11, 2007
National Taiwan University
Enboa Wu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Thermal enhanced low profile package structure and method for fabri...
Publication number
20060237827
Publication date
Oct 26, 2006
Industrial Technology Research Institute
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure of electronic package and method for fabricating the same
Publication number
20060108146
Publication date
May 25, 2006
Industrial Technology Research Institute
Enboa Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Light emitting diode covered with a reflective layer and method for...
Publication number
20060086943
Publication date
Apr 27, 2006
National Taiwan University
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE INCORPORATING DUAL STRESS BUFFER LAYERS FOR I/O...
Publication number
20020093107
Publication date
Jul 18, 2002
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Enboa Wu
H01 - BASIC ELECTRIC ELEMENTS