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Eng-Chew Cheah
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Thermally enhanced metal capped BGA package
Patent number
7,319,051
Issue date
Jan 15, 2008
Altera Corporation
Eng C. Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-tiered lead package for an integrated circuit
Patent number
7,199,477
Issue date
Apr 3, 2007
Altera Corporation
Eng-Chew Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanically enhanced package and method of making same
Patent number
6,894,229
Issue date
May 17, 2005
Altera Corporation
Eng C. Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced metal capped BGA package
Patent number
6,882,041
Issue date
Apr 19, 2005
Altera Corporation
Eng C. Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with improved thermal cycling performance, an...
Patent number
6,858,942
Issue date
Feb 22, 2005
Altera Corporation
Eng-Chew Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and process for forming the same
Patent number
6,818,968
Issue date
Nov 16, 2004
Altera Corporation
Eng-Chew Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with improved thermal cycling performance, an...
Patent number
6,627,517
Issue date
Sep 30, 2003
Altera Corporation
Eng-Chew Cheah
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Thermally enhanced metal capped BGA package
Publication number
20050179125
Publication date
Aug 18, 2005
Altera Corporation
Eng C. Cheah
H01 - BASIC ELECTRIC ELEMENTS