Eng Chiang Gan

Follow

Person

Penang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Method of thinning a wafer utilizing a laminated reinforcing layer...
- Patent number 6,713,366
- Issue date Mar 30, 2004
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF THINNING A WAFER UTILIZING A LAMINATED REINFORCING LAYER...
- Publication number 20030235937
- Publication date Dec 25, 2003
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS