Eng Wah Woo

Person

Ipoh, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor devices, and package molds for forming packa...
- Patent number 12,119,239
- Issue date Oct 15, 2024
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming packaged semiconductor devices and leadframes fo...
- Patent number 12,009,286
- Issue date Jun 11, 2024
- MACOM Technology Solutions Holdings, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) transistor amplifier packages with improved is...
- Patent number 11,581,859
- Issue date Feb 14, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
- Publication number 20240282679
- Publication date Aug 22, 2024
- MACOM Technology Solutions Holdings, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...
- Publication number 20240105390
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Kok Meng KAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR PACKAGE AND PROCESS OF IMPLEMENTING THE TRANSISTOR PACKAGE
- Publication number 20240105570
- Publication date Mar 28, 2024
- WOLFSPEED, INC.
- Eng Wah WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH EXPOSED HEAT DISSIPATING SURFACE...
- Publication number 20230421119
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE HAVING CONNECTED COMPONENTS AND PROCESSES IMPLEMENTIN...
- Publication number 20230402360
- Publication date Dec 14, 2023
- Wolfspeed, Inc.
- Alexander KOMPOSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING INCLUDING MODULAR...
- Publication number 20230327624
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Limiting Failures Caused by Dendrite Growth on Semiconductor Chips
- Publication number 20230215833
- Publication date Jul 6, 2023
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES, PACKAGED SEMICON...
- Publication number 20230162991
- Publication date May 25, 2023
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
- Publication number 20230117260
- Publication date Apr 20, 2023
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...
- Publication number 20220399318
- Publication date Dec 15, 2022
- Cree, Inc.
- Eng Wah WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) TRANSISTOR AMPLIFIER PACKAGES WITH IMPROVED IS...
- Publication number 20210408979
- Publication date Dec 30, 2021
- Cree, Inc.
- Alexander Komposch
- H03 - BASIC ELECTRONIC CIRCUITRY

Eng Wah Woo

Person

Patents Grantslast 30 patents

Packaged semiconductor devices, and package molds for forming packa...

Methods of forming packaged semiconductor devices and leadframes fo...

Integrated passive device (IPD) components and a package and proces...

Radio frequency (RF) transistor amplifier packages with improved is...

Patents Applicationslast 30 patents

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...

DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...

TRANSISTOR PACKAGE AND PROCESS OF IMPLEMENTING THE TRANSISTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGES WITH EXPOSED HEAT DISSIPATING SURFACE...

POWER PACKAGE HAVING CONNECTED COMPONENTS AND PROCESSES IMPLEMENTIN...

RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING INCLUDING MODULAR...

Limiting Failures Caused by Dendrite Growth on Semiconductor Chips

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES, PACKAGED SEMICON...

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...

INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...

RADIO FREQUENCY (RF) TRANSISTOR AMPLIFIER PACKAGES WITH IMPROVED IS...