Ennis Takashi Ogawa

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Capacitor-based method for determining and characterizing scribe se...
- Patent number 7,888,776
- Issue date Feb 15, 2011
- Texas Instruments Incorporated
- Ennis T. Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically inactive via for electromigration reliability improvement
- Patent number 7,566,652
- Issue date Jul 28, 2009
- Texas Instruments Incorporated
- Ki-Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple copper vias for integrated circuit metallization
- Patent number 7,078,817
- Issue date Jul 18, 2006
- Board of Regents, The University of Texas System
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Versatile system for diffusion limiting void formation
- Patent number 7,033,924
- Issue date Apr 25, 2006
- Texas Instruments Incorporated
- Ennis T. Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple copper vias for integrated circuit metallization and metho...
- Patent number 6,919,639
- Issue date Jul 19, 2005
- The Board of Regents, The University of Texas System
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Versatile system for diffusion limiting void formation
- Patent number 6,737,351
- Issue date May 18, 2004
- Texas Instruments Incorporated
- Ennis T. Ogawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR-BASED METHOD FOR DETERMINING AND CHARACTERIZING SCRIBE SE...
- Publication number 20090321734
- Publication date Dec 31, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Ennis T. Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically inactive via for electromigration reliability improvement
- Publication number 20080017989
- Publication date Jan 24, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Ki-Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple copper vias for integrated circuit metallization
- Publication number 20050093163
- Publication date May 5, 2005
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple copper vias for integrated circuit metallization and metho...
- Publication number 20040070078
- Publication date Apr 15, 2004
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Versatile system for diffusion limiting void formation
- Publication number 20040041274
- Publication date Mar 4, 2004
- Ennis T. Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Versatile system for diffusion limiting void formation
- Publication number 20030122260
- Publication date Jul 3, 2003
- Ennis T. Ogawa
- H01 - BASIC ELECTRIC ELEMENTS