EnYong Tai

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including independent film layer for embedding...
- Patent number 9,773,766
- Issue date Sep 26, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-uniform vacuum profile die attach tip
- Patent number 9,038,264
- Issue date May 26, 2015
- SanDisk Semiconductor (Shanghai) Co., Ltd.
- Pradeep Kumar Rai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...
- Publication number 20150221624
- Publication date Aug 6, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150187745
- Publication date Jul 2, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM VACUUM PROFILE DIE ATTACH TIP
- Publication number 20120216396
- Publication date Aug 30, 2012
- Pradeep Kumar Rai
- H01 - BASIC ELECTRIC ELEMENTS