Erasenthiran Poonjolai

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Microball assembly methods, and packages using maskless microball a...
- Patent number 8,207,057
- Issue date Jun 26, 2012
- Intel Corporation
- Erasenthiran Poonjolai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer cutting methods and packages using dice derived therefrom
- Patent number 7,795,116
- Issue date Sep 14, 2010
- Intel Corporation
- Mark Dydyk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND TOOLS FOR PREVENTING THE COUNTERFEITING AND TAMPERING O...
- Publication number 20240054502
- Publication date Feb 15, 2024
- Intel Corporation
- Michael A. SCHROEDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Microball assembly methods, and packages using maskless microball a...
- Publication number 20100155923
- Publication date Jun 24, 2010
- Erasenthiran Poonjolai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer cutting methods and packages using dice derived therefrom
- Publication number 20100078768
- Publication date Apr 1, 2010
- Mark Dydyk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for reducing defects through selective laser scribing
- Publication number 20100081255
- Publication date Apr 1, 2010
- Erasenthiran Poonjolai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR