Erdem Kaltalioglu

Person

Iselin, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
IC structure with interdigitated conductive elements between metal...
- Patent number 10,770,407
- Issue date Sep 8, 2020
- GLOBALFOUNDRIES Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having power rail structure and related method
- Patent number 10,438,890
- Issue date Oct 8, 2019
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically anchored C4 pad and method of forming same
- Patent number 10,388,617
- Issue date Aug 20, 2019
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer rigidity with reinforcement structure
- Patent number 10,325,862
- Issue date Jun 18, 2019
- GLOBALFOUNDRIES Inc.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reinforcement to reduce wafer curvature
- Patent number 10,304,783
- Issue date May 28, 2019
- International Business Machines Corporation
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for a security application
- Patent number 10,297,546
- Issue date May 21, 2019
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having power rail structure and related method
- Patent number 9,997,456
- Issue date Jun 12, 2018
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure integrity sensor having interdigitated conductive elem...
- Patent number 9,947,602
- Issue date Apr 17, 2018
- GLOBALFOUNDRIES Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reinforcement to reduce wafer curvature
- Patent number 9,852,999
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with variable dopant levels
- Patent number 9,768,065
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Inc.
- Ping-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer rigidity with reinforcement structure
- Patent number 9,761,539
- Issue date Sep 12, 2017
- GLOBALFOUNDRIES Inc.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV deep trench capacitor and anti-fuse structure
- Patent number 9,741,657
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain detection structures for bonded wafers and chips
- Patent number 9,553,054
- Issue date Jan 24, 2017
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,536,779
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for determining TDDB reliability at reduced...
- Patent number 9,524,916
- Issue date Dec 20, 2016
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically anchored backside C4 pad
- Patent number 9,478,509
- Issue date Oct 25, 2016
- GLOBALFOUNDRIES, INC.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,431,293
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivated copper chip pads
- Patent number 9,373,596
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through level vias and methods of formation thereof
- Patent number 9,330,974
- Issue date May 3, 2016
- Infineon Technologies AG
- Sunoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
E-fuse with hybrid metallization
- Patent number 9,305,879
- Issue date Apr 5, 2016
- GLOBALFOUNDRIES Inc.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,123,726
- Issue date Sep 1, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor article having a zig-zag guard ring and method of for...
- Patent number 9,082,781
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic fuse having a damaged region
- Patent number 9,059,170
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating chip dicing for metal-metal bonding and hybrid wafer b...
- Patent number 9,059,333
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic fuse line with modified cap
- Patent number 9,059,173
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect with hybrid metallization
- Patent number 9,059,166
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Random local metal cap layer formation for improved integrated circ...
- Patent number 9,054,108
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Random local metal cap layer formation for improved integrated circ...
- Patent number 8,906,799
- Issue date Dec 9, 2014
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack sensors for semiconductor devices
- Patent number 8,890,560
- Issue date Nov 18, 2014
- Infineon Technologies AG
- Erdem Kaltalioglu
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming electronic fuse line with modified cap
- Patent number 8,889,491
- Issue date Nov 18, 2014
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC STRUCTURE WITH INTERDIGITATED CONDUCTIVE ELEMENTS BETWEEN METAL...
- Publication number 20200219826
- Publication date Jul 9, 2020
- GLOBALFOUNDRIES INC.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY ANCHORED C4 PAD AND METHOD OF FORMING SAME
- Publication number 20190123005
- Publication date Apr 25, 2019
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR A SECURITY APPLICATION
- Publication number 20190027433
- Publication date Jan 24, 2019
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING POWER RAIL STRUCTURE AND RELATED METHOD
- Publication number 20180261538
- Publication date Sep 13, 2018
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE INTEGRITY SENSOR HAVING INTERDIGITATED CONDUCTIVE ELEM...
- Publication number 20180047648
- Publication date Feb 15, 2018
- GLOBALFOUNDRIES INC.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING POWER RAIL STRUCTURE AND RELATED METHOD
- Publication number 20180033718
- Publication date Feb 1, 2018
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RIGIDITY WITH REINFORCEMENT STRUCTURE
- Publication number 20180019214
- Publication date Jan 18, 2018
- GLOBALFOUNDRIES INC.
- Ronald G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER REINFORCEMENT TO REDUCE WAFER CURVATURE
- Publication number 20180005961
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER REINFORCEMENT TO REDUCE WAFER CURVATURE
- Publication number 20170098616
- Publication date Apr 6, 2017
- International Business Machines Corporation
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RIGIDITY WITH REINFORCEMENT STRUCTURE
- Publication number 20160379934
- Publication date Dec 29, 2016
- International Business Machines Corporation
- Ronald G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIN DETECTION STRUCTURES FOR BONDED WAFERS AND CHIPS
- Publication number 20160118348
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...
- Publication number 20150255417
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY ANCHORED BACKSIDE C4 PAD
- Publication number 20150255410
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255328
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255387
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV DEEP TRENCH CAPACITOR AND ANTI-FUSE STRUCTURE
- Publication number 20150235944
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...
- Publication number 20150155263
- Publication date Jun 4, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARTICLE HAVING A ZIG-ZAG GUARD RING
- Publication number 20150097297
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Formed With Dual Damascene Process
- Publication number 20150084196
- Publication date Mar 26, 2015
- INFINEON TECHNOLOGIES AG
- Philipp Riess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP CRACKSTOP
- Publication number 20150069609
- Publication date Mar 12, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Crack Sensors for Semiconductor Devices
- Publication number 20150035556
- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Erdem Kaltalioglu
- G01 - MEASURING TESTING
Information Patent Application
RANDOM LOCAL METAL CAP LAYER FORMATION FOR IMPROVED INTEGRATED CIRC...
- Publication number 20150028484
- Publication date Jan 29, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSE LINE WITH MODIFIED CAP
- Publication number 20150021736
- Publication date Jan 22, 2015
- International Business Machines Corporation
- RONALD G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
E-FUSE WITH HYBRID METALLIZATION
- Publication number 20140332923
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH HYBRID METALLIZATION
- Publication number 20140332963
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivated Copper Chip Pads
- Publication number 20140295661
- Publication date Oct 2, 2014
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSE HAVING A DAMAGED REGION
- Publication number 20140217612
- Publication date Aug 7, 2014
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSE LINE WITH MODIFIED CAP
- Publication number 20140210040
- Publication date Jul 31, 2014
- International Business Machines Corporation
- RONALD G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20140203436
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR DETERMINING TDDB RELIABILITY AT REDUCED...
- Publication number 20140118020
- Publication date May 1, 2014
- International Business Machines Corporation
- Ronald G. Filippi
- G01 - MEASURING TESTING

Erdem Kaltalioglu

Person

Patents Grantslast 30 patents

IC structure with interdigitated conductive elements between metal...

Interconnect structure having power rail structure and related method

Mechanically anchored C4 pad and method of forming same

Wafer rigidity with reinforcement structure

Wafer reinforcement to reduce wafer curvature

Interconnect structures for a security application

Interconnect structure having power rail structure and related method

IC structure integrity sensor having interdigitated conductive elem...

Wafer reinforcement to reduce wafer curvature

Interconnect structures with variable dopant levels

Wafer rigidity with reinforcement structure

TSV deep trench capacitor and anti-fuse structure

Strain detection structures for bonded wafers and chips

Selective local metal cap layer formation for improved electromigra...

Structures and methods for determining TDDB reliability at reduced...

Mechanically anchored backside C4 pad

Selective local metal cap layer formation for improved electromigra...

Passivated copper chip pads

Through level vias and methods of formation thereof

E-fuse with hybrid metallization

Selective local metal cap layer formation for improved electromigra...

Semiconductor article having a zig-zag guard ring and method of for...

Electronic fuse having a damaged region

Facilitating chip dicing for metal-metal bonding and hybrid wafer b...

Electronic fuse line with modified cap

Interconnect with hybrid metallization

Random local metal cap layer formation for improved integrated circ...

Random local metal cap layer formation for improved integrated circ...

Crack sensors for semiconductor devices

Method of forming electronic fuse line with modified cap

Patents Applicationslast 30 patents

IC STRUCTURE WITH INTERDIGITATED CONDUCTIVE ELEMENTS BETWEEN METAL...

MECHANICALLY ANCHORED C4 PAD AND METHOD OF FORMING SAME

INTERCONNECT STRUCTURES FOR A SECURITY APPLICATION

INTERCONNECT STRUCTURE HAVING POWER RAIL STRUCTURE AND RELATED METHOD

IC STRUCTURE INTEGRITY SENSOR HAVING INTERDIGITATED CONDUCTIVE ELEM...

INTERCONNECT STRUCTURE HAVING POWER RAIL STRUCTURE AND RELATED METHOD

WAFER RIGIDITY WITH REINFORCEMENT STRUCTURE

WAFER REINFORCEMENT TO REDUCE WAFER CURVATURE

WAFER REINFORCEMENT TO REDUCE WAFER CURVATURE

WAFER RIGIDITY WITH REINFORCEMENT STRUCTURE

STRAIN DETECTION STRUCTURES FOR BONDED WAFERS AND CHIPS

FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...

MECHANICALLY ANCHORED BACKSIDE C4 PAD

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

TSV DEEP TRENCH CAPACITOR AND ANTI-FUSE STRUCTURE

FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...

SEMICONDUCTOR ARTICLE HAVING A ZIG-ZAG GUARD RING

Devices Formed With Dual Damascene Process

3D CHIP CRACKSTOP

Crack Sensors for Semiconductor Devices

RANDOM LOCAL METAL CAP LAYER FORMATION FOR IMPROVED INTEGRATED CIRC...

ELECTRONIC FUSE LINE WITH MODIFIED CAP

E-FUSE WITH HYBRID METALLIZATION

INTERCONNECT WITH HYBRID METALLIZATION

Passivated Copper Chip Pads

ELECTRONIC FUSE HAVING A DAMAGED REGION

ELECTRONIC FUSE LINE WITH MODIFIED CAP

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

STRUCTURES AND METHODS FOR DETERMINING TDDB RELIABILITY AT REDUCED...