Eric A. Sanjuan

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mixed impedance leads for die packages and method of making the same
- Patent number 10,340,209
- Issue date Jul 2, 2019
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated bond wires for die packages and methods of manufacturing sai...
- Patent number 9,997,489
- Issue date Jun 12, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metalized molded plastic components for millimeter wave electronics...
- Patent number 9,960,468
- Issue date May 1, 2018
- REMEC BROADBAND WIRELESS NETWORKS, LLC
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat isolation structures for high bandwidth interconnects
- Patent number 9,859,188
- Issue date Jan 2, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package with low electromagnetic interference interconnection
- Patent number 9,824,997
- Issue date Nov 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die packaging with fully or partially fused dielectric leads
- Patent number 9,812,420
- Issue date Nov 7, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate less die package having wires with dielectric and metal c...
- Patent number 9,711,479
- Issue date Jul 18, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a lead with selectively modified electrica...
- Patent number 9,673,137
- Issue date Jun 6, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost high frequency device package and methods
- Patent number 9,275,961
- Issue date Mar 1, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a high frequency device package
- Patent number 8,839,508
- Issue date Sep 23, 2014
- Rosenberger Hochfrequenztechnick GmbH & Co. KG
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost high frequency device package and methods
- Patent number 8,581,113
- Issue date Nov 12, 2013
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IPC COATING FOR PRINTHEAD
- Publication number 20240424788
- Publication date Dec 26, 2024
- FUJIFILM DIMATIX, INC.
- Sean Cahill
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PROCESS FOR AN IPC COATING
- Publication number 20240424791
- Publication date Dec 26, 2024
- FUJIFILM DIMATIX, INC.
- Shane Boyd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS...
- Publication number 20180248242
- Publication date Aug 30, 2018
- REMEC BROADBAND WIRELESS NETWORKS, LLC
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170271296
- Publication date Sep 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170125370
- Publication date May 4, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGING WITH FULLY OR PARTIALLY FUSED DIELECTRIC LEADS
- Publication number 20160379952
- Publication date Dec 29, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT ISOLATION STRUCTURES FOR HIGH BANDWIDTH INTERCONNECTS
- Publication number 20160379911
- Publication date Dec 29, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH LOW ELECTROMAGNETIC INTERFERENCE INTERCONNECTION
- Publication number 20160379954
- Publication date Dec 29, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SUBSTRATE LESS DIE PACKAGE HAVING WIRES WITH DIELECTRIC AND METAL...
- Publication number 20160372440
- Publication date Dec 22, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED IMPEDANCE LEADS FOR DIE PACKAGES AND METHOD OF MAKING THE SAME
- Publication number 20160372402
- Publication date Dec 22, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A LEAD WITH SELECTIVELY MODIFIED ELECTRICA...
- Publication number 20160190047
- Publication date Jun 30, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS...
- Publication number 20140070904
- Publication date Mar 13, 2014
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120234588
- Publication date Sep 20, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120066894
- Publication date Mar 22, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Cost High Frequency Device Package and Methods
- Publication number 20090159320
- Publication date Jun 25, 2009
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Eric A. Sanjuan

Person

Patents Grantslast 30 patents

Mixed impedance leads for die packages and method of making the same

Coated bond wires for die packages and methods of manufacturing sai...

Metalized molded plastic components for millimeter wave electronics...

Heat isolation structures for high bandwidth interconnects

Die package with low electromagnetic interference interconnection

Die packaging with fully or partially fused dielectric leads

Substrate less die package having wires with dielectric and metal c...

Electronic device having a lead with selectively modified electrica...

Low cost high frequency device package and methods

Method of making a high frequency device package

Low cost high frequency device package and methods

Patents Applicationslast 30 patents

IPC COATING FOR PRINTHEAD

PROCESS FOR AN IPC COATING

METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

DIE PACKAGING WITH FULLY OR PARTIALLY FUSED DIELECTRIC LEADS

HEAT ISOLATION STRUCTURES FOR HIGH BANDWIDTH INTERCONNECTS

DIE PACKAGE WITH LOW ELECTROMAGNETIC INTERFERENCE INTERCONNECTION

A SUBSTRATE LESS DIE PACKAGE HAVING WIRES WITH DIELECTRIC AND METAL...

MIXED IMPEDANCE LEADS FOR DIE PACKAGES AND METHOD OF MAKING THE SAME

ELECTRONIC DEVICE HAVING A LEAD WITH SELECTIVELY MODIFIED ELECTRICA...

METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS...

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

Low Cost High Frequency Device Package and Methods