Eric B. Hultmark

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Technique for underfilling stacked chips on a cavity MLC module
- Patent number 6,599,774
- Issue date Jul 29, 2003
- International Business Machines Corporation
- Eric B. Hultmark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a multi-layered ceramic package
- Patent number 6,332,946
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Michael Emmett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for underfilling stacked chips on a cavity MLC module
- Patent number 6,232,667
- Issue date May 15, 2001
- International Business Machines Corporation
- Eric B. Hultmark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for multi-layered ceramic package assembly
- Patent number 6,112,795
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Michael Emmett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module adjustment design and process using shims
- Patent number 6,049,456
- Issue date Apr 11, 2000
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink or similar article
- Patent number D304715
- Issue date Nov 21, 1989
- International Business Machines Corporation
- Joseph L. Horvath
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Ceramic card assembly having enhanced power distribution and cooling
- Patent number 4,771,366
- Issue date Sep 13, 1988
- International Business Machines Corporation
- Bruce E. Blake
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink for electronic package
- Patent number 4,546,405
- Issue date Oct 8, 1985
- International Business Machines Corporation
- Eric B. Hultmark
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Technique for underfilling stacked chips on a cavity MLC module
- Publication number 20010021542
- Publication date Sep 13, 2001
- International Business Machines Corporation
- Eric B. Hultmark
- H01 - BASIC ELECTRIC ELEMENTS

Eric B. Hultmark

Person

Patents Grantslast 30 patents

Technique for underfilling stacked chips on a cavity MLC module

Method for assembling a multi-layered ceramic package

Technique for underfilling stacked chips on a cavity MLC module

Fixture for multi-layered ceramic package assembly

Electronic module adjustment design and process using shims

Heat sink or similar article

Ceramic card assembly having enhanced power distribution and cooling

Heat sink for electronic package

Patents Applicationslast 30 patents

Technique for underfilling stacked chips on a cavity MLC module